Wafer level characterisation of microelectrodes for electrochemical sensing applications

E. O. Blair; L. Parga Basanta; I. Schmueser; J. R. K. Marland; A. Buchoux; A. Tsiamis; C. Dunare; M. Normand; A. A. Stokes; A. J. Walton; S. Smith

doi:10.1109/ICMTS.2018.8383793

Wafer level characterisation of microelectrodes for electrochemical sensing applications

E. O. Blair, L. Parga Basanta, I. Schmueser, J. R. K. Marland, A. Buchoux, A. Tsiamis, C. Dunare, M. Normand, A. A. Stokes, A. J. Walton, S. Smith

Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

4 Citations (Scopus)

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Abstract

This work presents a system for the in-line wafer-level characterisation of electrochemical sensors. Typically, such sensors are first diced and packaged before being electro-chemically tested. By integrating their characterisation into the manufacturing process, the production of electrochemical sensors becomes more efficient and less expensive as they can be parametrically tested midway through the fabrication process, without the need to package them. This enables malfunctioning or failed devices to be identified before dicing and reduces costs as only functional devices are packaged (in many cases this can be more expensive than the sensor fabrication). This study describes wafer-level characterisation of a simple electrochemical sensor design using a photoresist hydrophobic corralling film for the electrolyte and a probe station for contacting to individual dies.

Original language	English
Title of host publication	2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)
Place of Publication	Piscataway, NJ.
Pages	179-184
Number of pages	6
Volume	2018-March
ISBN (Electronic)	9781538650691
DOIs	https://doi.org/10.1109/ICMTS.2018.8383793
Publication status	Published - 12 Jun 2018
Event	2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018 - Austin, United States Duration: 19 Mar 2018 → 22 Mar 2018

Conference

Conference	2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018
Country/Territory	United States
City	Austin
Period	19/03/18 → 22/03/18

Keywords

electrochemical sensors
microfabrication
electrochemical systems
wafer-level measurement
semiconductor

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10.1109/ICMTS.2018.8383793

Blair-etal-ICMTS-2018-Wafer-level-characterisation-of-microelectrodes-for-electrochemical-sensing-applicationsAccepted author manuscript, 6.33 MB

https://www.research.ed.ac.uk/portal/en/publications/wafer-level-characterisation-of-microelectrodes-for-electrochemical-sensing-applications(773c0bbd-1d4a-4e83-b509-27676c3ee022).html

Cite this

Blair, E. O., Basanta, L. P., Schmueser, I., Marland, J. R. K., Buchoux, A., Tsiamis, A., Dunare, C., Normand, M., Stokes, A. A., Walton, A. J., & Smith, S. (2018). Wafer level characterisation of microelectrodes for electrochemical sensing applications. In 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) (Vol. 2018-March, pp. 179-184). https://doi.org/10.1109/ICMTS.2018.8383793

@inproceedings{962f97b0bf6c44e3b7880ac94aa41ecf,

title = "Wafer level characterisation of microelectrodes for electrochemical sensing applications",

abstract = "This work presents a system for the in-line wafer-level characterisation of electrochemical sensors. Typically, such sensors are first diced and packaged before being electro-chemically tested. By integrating their characterisation into the manufacturing process, the production of electrochemical sensors becomes more efficient and less expensive as they can be parametrically tested midway through the fabrication process, without the need to package them. This enables malfunctioning or failed devices to be identified before dicing and reduces costs as only functional devices are packaged (in many cases this can be more expensive than the sensor fabrication). This study describes wafer-level characterisation of a simple electrochemical sensor design using a photoresist hydrophobic corralling film for the electrolyte and a probe station for contacting to individual dies.",

keywords = "electrochemical sensors, microfabrication, electrochemical systems, wafer-level measurement, semiconductor",

author = "Blair, {E. O.} and Basanta, {L. Parga} and I. Schmueser and Marland, {J. R. K.} and A. Buchoux and A. Tsiamis and C. Dunare and M. Normand and Stokes, {A. A.} and Walton, {A. J.} and S. Smith",

note = "{\textcopyright} 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.; 2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018 ; Conference date: 19-03-2018 Through 22-03-2018",

year = "2018",

month = jun,

day = "12",

doi = "10.1109/ICMTS.2018.8383793",

language = "English",

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pages = "179--184",

booktitle = "2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)",

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Blair, EO, Basanta, LP, Schmueser, I, Marland, JRK, Buchoux, A, Tsiamis, A, Dunare, C, Normand, M, Stokes, AA, Walton, AJ & Smith, S 2018, Wafer level characterisation of microelectrodes for electrochemical sensing applications. in 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS). vol. 2018-March, Piscataway, NJ., pp. 179-184, 2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018, Austin, United States, 19/03/18. https://doi.org/10.1109/ICMTS.2018.8383793

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T1 - Wafer level characterisation of microelectrodes for electrochemical sensing applications

AU - Blair, E. O.

AU - Basanta, L. Parga

AU - Schmueser, I.

AU - Marland, J. R. K.

AU - Buchoux, A.

AU - Tsiamis, A.

AU - Dunare, C.

AU - Normand, M.

AU - Stokes, A. A.

AU - Walton, A. J.

AU - Smith, S.

N1 - © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2018/6/12

Y1 - 2018/6/12

N2 - This work presents a system for the in-line wafer-level characterisation of electrochemical sensors. Typically, such sensors are first diced and packaged before being electro-chemically tested. By integrating their characterisation into the manufacturing process, the production of electrochemical sensors becomes more efficient and less expensive as they can be parametrically tested midway through the fabrication process, without the need to package them. This enables malfunctioning or failed devices to be identified before dicing and reduces costs as only functional devices are packaged (in many cases this can be more expensive than the sensor fabrication). This study describes wafer-level characterisation of a simple electrochemical sensor design using a photoresist hydrophobic corralling film for the electrolyte and a probe station for contacting to individual dies.

AB - This work presents a system for the in-line wafer-level characterisation of electrochemical sensors. Typically, such sensors are first diced and packaged before being electro-chemically tested. By integrating their characterisation into the manufacturing process, the production of electrochemical sensors becomes more efficient and less expensive as they can be parametrically tested midway through the fabrication process, without the need to package them. This enables malfunctioning or failed devices to be identified before dicing and reduces costs as only functional devices are packaged (in many cases this can be more expensive than the sensor fabrication). This study describes wafer-level characterisation of a simple electrochemical sensor design using a photoresist hydrophobic corralling film for the electrolyte and a probe station for contacting to individual dies.

KW - electrochemical sensors

KW - microfabrication

KW - electrochemical systems

KW - wafer-level measurement

KW - semiconductor

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U2 - 10.1109/ICMTS.2018.8383793

DO - 10.1109/ICMTS.2018.8383793

M3 - Conference contribution book

AN - SCOPUS:85049264170

VL - 2018-March

SP - 179

EP - 184

BT - 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)

CY - Piscataway, NJ.

T2 - 2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018

Y2 - 19 March 2018 through 22 March 2018

ER -

Wafer level characterisation of microelectrodes for electrochemical sensing applications

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