Wafer level characterisation of microelectrodes for electrochemical sensing applications

E. O. Blair, L. Parga Basanta, I. Schmueser, J. R. K. Marland, A. Buchoux, A. Tsiamis, C. Dunare, M. Normand, A. A. Stokes, A. J. Walton, S. Smith

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

1 Citation (Scopus)

Abstract

This work presents a system for the in-line wafer-level characterisation of electrochemical sensors. Typically, such sensors are first diced and packaged before being electro-chemically tested. By integrating their characterisation into the manufacturing process, the production of electrochemical sensors becomes more efficient and less expensive as they can be parametrically tested midway through the fabrication process, without the need to package them. This enables malfunctioning or failed devices to be identified before dicing and reduces costs as only functional devices are packaged (in many cases this can be more expensive than the sensor fabrication). This study describes wafer-level characterisation of a simple electrochemical sensor design using a photoresist hydrophobic corralling film for the electrolyte and a probe station for contacting to individual dies.

LanguageEnglish
Title of host publication2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)
Place of PublicationPiscataway, NJ.
Pages179-184
Number of pages6
Volume2018-March
ISBN (Electronic)9781538650691
DOIs
Publication statusPublished - 12 Jun 2018
Event2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018 - Austin, United States
Duration: 19 Mar 201822 Mar 2018

Conference

Conference2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018
CountryUnited States
CityAustin
Period19/03/1822/03/18

Fingerprint

Electrochemical sensors
Microelectrodes
Fabrication
Sensors
Photoresists
Electrolytes
Costs

Keywords

  • electrochemical sensors
  • microfabrication
  • electrochemical systems
  • wafer-level measurement
  • semiconductor

Cite this

Blair, E. O., Basanta, L. P., Schmueser, I., Marland, J. R. K., Buchoux, A., Tsiamis, A., ... Smith, S. (2018). Wafer level characterisation of microelectrodes for electrochemical sensing applications. In 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) (Vol. 2018-March, pp. 179-184). Piscataway, NJ.. https://doi.org/10.1109/ICMTS.2018.8383793
Blair, E. O. ; Basanta, L. Parga ; Schmueser, I. ; Marland, J. R. K. ; Buchoux, A. ; Tsiamis, A. ; Dunare, C. ; Normand, M. ; Stokes, A. A. ; Walton, A. J. ; Smith, S. / Wafer level characterisation of microelectrodes for electrochemical sensing applications. 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS). Vol. 2018-March Piscataway, NJ., 2018. pp. 179-184
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Blair, EO, Basanta, LP, Schmueser, I, Marland, JRK, Buchoux, A, Tsiamis, A, Dunare, C, Normand, M, Stokes, AA, Walton, AJ & Smith, S 2018, Wafer level characterisation of microelectrodes for electrochemical sensing applications. in 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS). vol. 2018-March, Piscataway, NJ., pp. 179-184, 2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018, Austin, United States, 19/03/18. https://doi.org/10.1109/ICMTS.2018.8383793

Wafer level characterisation of microelectrodes for electrochemical sensing applications. / Blair, E. O.; Basanta, L. Parga; Schmueser, I.; Marland, J. R. K.; Buchoux, A.; Tsiamis, A.; Dunare, C.; Normand, M.; Stokes, A. A.; Walton, A. J.; Smith, S.

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS). Vol. 2018-March Piscataway, NJ., 2018. p. 179-184.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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AU - Stokes, A. A.

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N1 - © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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Blair EO, Basanta LP, Schmueser I, Marland JRK, Buchoux A, Tsiamis A et al. Wafer level characterisation of microelectrodes for electrochemical sensing applications. In 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS). Vol. 2018-March. Piscataway, NJ. 2018. p. 179-184 https://doi.org/10.1109/ICMTS.2018.8383793