Validation of MEMS acceleration measurements for seismic monitoring with LVDT and vision system

Davide Trapani, Nicolo Biasi, Mariolino De Cecco, Daniele Zonta

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

6 Citations (Scopus)

Abstract

Recent improvements in Micro-Electro-Mechanical Systems (MEMS) and wireless transmission technologies today allow researchers to overcome some of the limitations of tethered structural monitoring systems, such as their high installation and maintenance costs. This paper presents a new-generation monitoring system based on MEMS and wireless transmission. This is an integrated system consisting of a set of small acceleration and strain sensors, distributed within the structure. The sensors have on-board computational capabilities and can transmit recorded data to a remote acquisition unit. This unit automatically records and interprets the data, and provides the user with a damage index representing the structural safety after a seismic event. Specifically developed algorithms which estimate the displacement time histories based on the accelerations recorded during the earthquake are used to perform this task. The aim of this paper is to assess the reliability of these algorithms, by comparing the output of the prototype monitoring system in terms of displacement with data from other measuring systems, such as linear voltage displacement transducers (LVDT) and multiple cameras.

LanguageEnglish
Title of host publication2012 IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Proceedings
Place of PublicationPiscataway, NJ.
PublisherIEEE
Pages104-109
Number of pages6
ISBN (Print)9781467327374
DOIs
Publication statusPublished - 2012
Event2012 3rd IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Perugia, Italy
Duration: 28 Sep 201228 Sep 2012

Conference

Conference2012 3rd IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012
CountryItaly
CityPerugia
Period28/09/1228/09/12

Fingerprint

Acceleration measurement
Transducers
Monitoring
Electric potential
Sensors
Earthquakes
Cameras
Costs

Keywords

  • damage assessment
  • laboratory validation
  • MEMS
  • vision system
  • wireless

Cite this

Trapani, D., Biasi, N., De Cecco, M., & Zonta, D. (2012). Validation of MEMS acceleration measurements for seismic monitoring with LVDT and vision system. In 2012 IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Proceedings (pp. 104-109). [6348394] Piscataway, NJ. : IEEE. https://doi.org/10.1109/EESMS.2012.6348394
Trapani, Davide ; Biasi, Nicolo ; De Cecco, Mariolino ; Zonta, Daniele. / Validation of MEMS acceleration measurements for seismic monitoring with LVDT and vision system. 2012 IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Proceedings. Piscataway, NJ. : IEEE, 2012. pp. 104-109
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Trapani, D, Biasi, N, De Cecco, M & Zonta, D 2012, Validation of MEMS acceleration measurements for seismic monitoring with LVDT and vision system. in 2012 IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Proceedings., 6348394, IEEE, Piscataway, NJ. , pp. 104-109, 2012 3rd IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012, Perugia, Italy, 28/09/12. https://doi.org/10.1109/EESMS.2012.6348394

Validation of MEMS acceleration measurements for seismic monitoring with LVDT and vision system. / Trapani, Davide; Biasi, Nicolo; De Cecco, Mariolino; Zonta, Daniele.

2012 IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Proceedings. Piscataway, NJ. : IEEE, 2012. p. 104-109 6348394.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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Trapani D, Biasi N, De Cecco M, Zonta D. Validation of MEMS acceleration measurements for seismic monitoring with LVDT and vision system. In 2012 IEEE Workshop on Environmental, Energy, and Structural Monitoring Systems, EESMS 2012 - Proceedings. Piscataway, NJ. : IEEE. 2012. p. 104-109. 6348394 https://doi.org/10.1109/EESMS.2012.6348394