Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study

P. Boinard, W.M. Banks, R.A. Pethrick

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

A study of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Fröhlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.
Original languageEnglish
Pages (from-to)1015-1026
Number of pages11
JournalJournal of Adhesion
Volume78
Issue number12
DOIs
Publication statusPublished - 2002

Keywords

  • adhesively bonded composite structure
  • dielectric spectroscopy
  • Kirkwood-Frohlich equation
  • dipolar activity
  • dynamic mechanical thermal analysis
  • pure and applied chemistry
  • mechanical engineering

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