Underpotential deposition of Cu on Au(111) from neutral chloride containing electrolyte

Hannah Aitchison, Nikolaus Meyerbröker, Tien-Lin Lee, Jörg Zegenhagen, Thomas Potter, Herbert Früchtl, Izabela Cebula, Manfred Buck

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Abstract

The structure of a chloride terminated copper monolayer electrodeposited onto Au(111) from a CuSO4/KCl electrolyte was investigated ex situ by three complementary experimental techniques (scanning tunneling microscopy (STM), photoelectron spectroscopy (PES), X-ray standing wave (XSW) excitation) and density functional theory (DFT) calculations. STM at atomic resolution reveals a stable, highly ordered layer which exhibits a Moiré structure and is described by a (5 × 5) unit cell. The XSW/PES data yield a well-defined position of the Cu layer and the value of 2.16 Å above the topmost Au layer suggests that the atoms are adsorbed in threefold hollow sites. The chloride exhibits some distribution around a distance of 3.77 Å in agreement with the observed Moiré pattern due to a higher order commensurate lattice. This structure, a high order commensurate Cl overlayer on top of a commensurate (1 × 1) Cu layer with Cu at threefold hollow sites, is corroborated by the DFT calculations.
Original languageEnglish
Pages (from-to)24146-24153
Number of pages8
JournalPhysical Chemistry Chemical Physics
Volume19
Early online date15 Aug 2017
DOIs
Publication statusE-pub ahead of print - 15 Aug 2017

Keywords

  • Cu on Au(111)
  • electrolyte
  • Moiré pattern
  • chloride

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    Aitchison, H., Meyerbröker, N., Lee, T-L., Zegenhagen, J., Potter, T., Früchtl, H., Cebula, I., & Buck, M. (2017). Underpotential deposition of Cu on Au(111) from neutral chloride containing electrolyte. Physical Chemistry Chemical Physics, 19, 24146-24153. https://doi.org/10.1039/C7CP04244B