Transient electrochemical processes during Cu-Ni deposition

W. R A Meuleman, S. Roy*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

Recent investigations on nanostructured metal multilayers have shown that interfaces between each bi-layer can affect the properties of a multilayer. Transient current and potential data after the application of a potential step or a current step, respectively, during the codeposition of copper and nickel from a citrate electrolyte have been investigated. It has been found that on the application of a current step only copper is reduced at first, followed by the deposition of a copper-nickel alloy. Once the current is switched off, nickel (or a nickel-rich) alloy is dissolved from the deposit due to displacement by copper. Transient potentials and steady-state polarisation data can be used to determine the amount of nickel dissolved from a deposit.

Original languageEnglish
Pages (from-to)55-58
Number of pages4
JournalTransactions of the Institute of Metal Finishing
Volume81
Issue number2
DOIs
Publication statusPublished - Mar 2003

Keywords

  • Copper-nickel alloys
  • Current transient
  • Displacement reaction
  • Electrodeposition
  • Potential transient

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