Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Helena Gleskova; I. Chun Cheng; Sigurd Wagner; Zhigang Suo

doi:10.1063/1.2161391

Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Helena Gleskova^*, I. Chun Cheng, Sigurd Wagner, Zhigang Suo

^*Corresponding author for this work

Electronic And Electrical Engineering

Research output: Contribution to journal › Article › peer-review

24 Citations (Scopus)

Abstract

A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.

Original language	English
Article number	011905
Number of pages	3
Journal	Applied Physics Letters
Volume	88
Issue number	1
Early online date	3 Jan 2006
DOIs	https://doi.org/10.1063/1.2161391
Publication status	Published - 10 Apr 2006

Keywords

flexible electronics
thin film circuits
elongation
integrated circuit technology

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10.1063/1.2161391

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AU - Wagner, Sigurd

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KW - integrated circuit technology

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Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

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Keywords

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