Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Helena Gleskova, I. Chun Cheng, Sigurd Wagner, Zhigang Suo

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.
Original languageEnglish
Article number011905
Number of pages3
JournalApplied Physics Letters
Volume88
Issue number1
Early online date3 Jan 2006
DOIs
Publication statusPublished - 10 Apr 2006

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Keywords

  • flexible electronics
  • thin film circuits
  • elongation
  • integrated circuit technology

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