Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Helena Gleskova, I. Chun Cheng, Sigurd Wagner, Zhigang Suo

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.
LanguageEnglish
Article number011905
Number of pages3
JournalApplied Physics Letters
Volume88
Issue number1
Early online date3 Jan 2006
DOIs
Publication statusPublished - 10 Apr 2006

Fingerprint

alignment
thin films
electronics
dimensional stability
photomasks
elongation
fabrication
room temperature
temperature

Keywords

  • flexible electronics
  • thin film circuits
  • elongation
  • integrated circuit technology

Cite this

@article{23c3e8f29dab468eb39abde8235436ee,
title = "Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits",
abstract = "A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.",
keywords = "flexible electronics, thin film circuits, elongation, integrated circuit technology",
author = "Helena Gleskova and Cheng, {I. Chun} and Sigurd Wagner and Zhigang Suo",
year = "2006",
month = "4",
day = "10",
doi = "10.1063/1.2161391",
language = "English",
volume = "88",
journal = "Applied Physics Letters",
issn = "0003-6951",
number = "1",

}

Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits. / Gleskova, Helena; Cheng, I. Chun; Wagner, Sigurd; Suo, Zhigang.

In: Applied Physics Letters, Vol. 88, No. 1, 011905, 10.04.2006.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

AU - Gleskova, Helena

AU - Cheng, I. Chun

AU - Wagner, Sigurd

AU - Suo, Zhigang

PY - 2006/4/10

Y1 - 2006/4/10

N2 - A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.

AB - A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.

KW - flexible electronics

KW - thin film circuits

KW - elongation

KW - integrated circuit technology

UR - http://www.scopus.com/inward/record.url?scp=33645531090&partnerID=8YFLogxK

U2 - 10.1063/1.2161391

DO - 10.1063/1.2161391

M3 - Article

VL - 88

JO - Applied Physics Letters

T2 - Applied Physics Letters

JF - Applied Physics Letters

SN - 0003-6951

IS - 1

M1 - 011905

ER -