Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Helena Gleskova, I. Chun Cheng, Sigurd Wagner, Zhigang Suo

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)


A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.
Original languageEnglish
Article number011905
Number of pages3
JournalApplied Physics Letters
Issue number1
Early online date3 Jan 2006
Publication statusPublished - 10 Apr 2006


  • flexible electronics
  • thin film circuits
  • elongation
  • integrated circuit technology


Dive into the research topics of 'Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits'. Together they form a unique fingerprint.

Cite this