The grain size distribution investigation of high purity plating Cu wire in depth direction

Yiqing Ke, T Namekawa, Tatyana Konkova, J. Onuki

Research output: Contribution to conferenceProceeding

Abstract

[Abstract unavailable]

Conference

ConferenceInternational Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012)
CountryRussian Federation
CityUfa
Period8/10/1212/10/12

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Plating
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Keywords

  • nanomaterials
  • grain boundaries

Cite this

Ke, Y., Namekawa, T., Konkova, T., & Onuki, J. (2012). The grain size distribution investigation of high purity plating Cu wire in depth direction. 38. International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), Ufa, Russian Federation.
Ke, Yiqing ; Namekawa, T ; Konkova, Tatyana ; Onuki, J. / The grain size distribution investigation of high purity plating Cu wire in depth direction. International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), Ufa, Russian Federation.1 p.
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title = "The grain size distribution investigation of high purity plating Cu wire in depth direction",
abstract = "[Abstract unavailable]",
keywords = "nanomaterials, grain boundaries",
author = "Yiqing Ke and T Namekawa and Tatyana Konkova and J. Onuki",
year = "2012",
language = "English",
pages = "38",
note = "International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012) ; Conference date: 08-10-2012 Through 12-10-2012",

}

Ke, Y, Namekawa, T, Konkova, T & Onuki, J 2012, 'The grain size distribution investigation of high purity plating Cu wire in depth direction' International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), Ufa, Russian Federation, 8/10/12 - 12/10/12, pp. 38.

The grain size distribution investigation of high purity plating Cu wire in depth direction. / Ke, Yiqing; Namekawa, T; Konkova, Tatyana; Onuki, J.

2012. 38 International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), Ufa, Russian Federation.

Research output: Contribution to conferenceProceeding

TY - CONF

T1 - The grain size distribution investigation of high purity plating Cu wire in depth direction

AU - Ke, Yiqing

AU - Namekawa, T

AU - Konkova, Tatyana

AU - Onuki, J.

PY - 2012

Y1 - 2012

N2 - [Abstract unavailable]

AB - [Abstract unavailable]

KW - nanomaterials

KW - grain boundaries

M3 - Proceeding

SP - 38

ER -

Ke Y, Namekawa T, Konkova T, Onuki J. The grain size distribution investigation of high purity plating Cu wire in depth direction. 2012. International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), Ufa, Russian Federation.