Test structures for the characterisation of sensor packaging technology

E. O. Blair, A. Buchoux, A. Tsiamis, C. Dunare, J.R.K. Marland, J.G. Terry, S. Smith, A.J. Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

4 Citations (Scopus)
7 Downloads (Pure)

Abstract

This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

Original languageEnglish
Title of host publication2017 International Conference of Microelectronic Test Structures (ICMTS)
Place of PublicationPiscataway, N.J.
PublisherIEEE
Number of pages6
ISBN (Print)9781509036165
DOIs
Publication statusPublished - 20 Jun 2017
Event2017 International Conference of Microelectronic Test Structures, ICMTS 2017 - Grenoble, France
Duration: 27 Mar 201730 Mar 2017

Conference

Conference2017 International Conference of Microelectronic Test Structures, ICMTS 2017
CountryFrance
CityGrenoble
Period27/03/1730/03/17

Keywords

  • resins
  • packaging
  • electrodes
  • current measurement
  • aluminum wires
  • electronics packaging

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