Test structures for the characterisation of sensor packaging technology

E. O. Blair; A. Buchoux; A. Tsiamis; C. Dunare; J.R.K. Marland; J.G. Terry; S. Smith; A.J. Walton

doi:10.1109/ICMTS.2017.7954279

Test structures for the characterisation of sensor packaging technology

E. O. Blair, A. Buchoux, A. Tsiamis, C. Dunare, J.R.K. Marland, J.G. Terry, S. Smith, A.J. Walton

Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

4 Citations (Scopus)

19 Downloads (Pure)

Abstract

This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

Original language	English
Title of host publication	2017 International Conference of Microelectronic Test Structures (ICMTS)
Place of Publication	Piscataway, N.J.
Publisher	IEEE
Number of pages	6
ISBN (Print)	9781509036165
DOIs	https://doi.org/10.1109/ICMTS.2017.7954279
Publication status	Published - 20 Jun 2017
Event	2017 International Conference of Microelectronic Test Structures, ICMTS 2017 - Grenoble, France Duration: 27 Mar 2017 → 30 Mar 2017

Conference

Conference	2017 International Conference of Microelectronic Test Structures, ICMTS 2017
Country/Territory	France
City	Grenoble
Period	27/03/17 → 30/03/17

Keywords

resins
packaging
electrodes
current measurement
aluminum wires
electronics packaging

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10.1109/ICMTS.2017.7954279

Blair-etal-ICMTS-2017-Test-structures-for-the-characterisation-of-sensor-packaging-technologyAccepted author manuscript, 0.98 MB

Cite this

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keywords = "resins, packaging, electrodes, current measurement, aluminum wires, electronics packaging",

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Blair, EO, Buchoux, A, Tsiamis, A, Dunare, C, Marland, JRK, Terry, JG, Smith, S & Walton, AJ 2017, Test structures for the characterisation of sensor packaging technology. in 2017 International Conference of Microelectronic Test Structures (ICMTS). IEEE, Piscataway, N.J., 2017 International Conference of Microelectronic Test Structures, ICMTS 2017, Grenoble, France, 27/03/17. https://doi.org/10.1109/ICMTS.2017.7954279

TY - GEN

T1 - Test structures for the characterisation of sensor packaging technology

AU - Blair, E. O.

AU - Buchoux, A.

AU - Tsiamis, A.

AU - Dunare, C.

AU - Marland, J.R.K.

AU - Terry, J.G.

AU - Smith, S.

AU - Walton, A.J.

PY - 2017/6/20

Y1 - 2017/6/20

N2 - This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

AB - This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

KW - resins

KW - packaging

KW - electrodes

KW - current measurement

KW - aluminum wires

KW - electronics packaging

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UR - https://www.research.ed.ac.uk/portal/en/publications/test-structures-for-the-characterisation-of-sensor-packaging-technology(32812bee-5218-4ed3-b9fa-42dd29c909db).html

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M3 - Conference contribution book

AN - SCOPUS:85023171646

SN - 9781509036165

BT - 2017 International Conference of Microelectronic Test Structures (ICMTS)

PB - IEEE

CY - Piscataway, N.J.

T2 - 2017 International Conference of Microelectronic Test Structures, ICMTS 2017

Y2 - 27 March 2017 through 30 March 2017

ER -

Test structures for the characterisation of sensor packaging technology

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Keywords

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