Temperature distribution simulation in an MV switchgear bus bar chamber

Mijodrag Miljanovic; Martin Kearns; Brian G. Stewart

Temperature distribution simulation in an MV switchgear bus bar chamber

Mijodrag Miljanovic, Martin Kearns, Brian G. Stewart

Electronic And Electrical Engineering

Research output: Contribution to conference › Paper › peer-review

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Abstract

Temperature is one of the main contributors for the decrease of switchgear insulation withstand capability and life expectancy. Unattended temperature rise can lead to overheating of switchgear insulation causing insulation breakdown and hence switchgear outage. This work presents a simulation investigation of how temperature hot spots may be detected by studying the surface temperature distribution along a switchgear bus bar chamber wall. A three-dimensional (3-D) finite element method (FEM) MV switchgear bus bar chamber is created. The heat dissipation caused by bus bar load currents and thermal localized hot spots caused by increased contact resistances is investigated. It is shown that it may be possible to detect inner hot spots on the surface of switchgear chamber walls. It is also shown that the coating and the emissivity factor of the walls have a significant influence on the detected surface temperature.

Original language	English
Pages	1-4
Number of pages	4
Publication status	Published - 30 Oct 2022
Event	2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena - Hilton Garden Inn Denver Union Station, Denver, United States Duration: 30 Oct 2022 → 2 Nov 2022 https://ceidp.org/

Conference

Conference	2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Abbreviated title	CEIDP 2022
Country/Territory	United States
City	Denver
Period	30/10/22 → 2/11/22
Internet address	https://ceidp.org/

Keywords

switchgear insulation
temperature distribution
EM and thermal analysis
finite element method
bus bar

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

Miljanovic-etal-IEEE-CEIDP-2022-Temperature-distribution-simulation-in-an-MV-switchgearAccepted author manuscript, 1.06 MBLicence: Strath_1

Cite this

@conference{2c26b52c4b694e968f11026b886430cd,

title = "Temperature distribution simulation in an MV switchgear bus bar chamber",

abstract = "Temperature is one of the main contributors for the decrease of switchgear insulation withstand capability and life expectancy. Unattended temperature rise can lead to overheating of switchgear insulation causing insulation breakdown and hence switchgear outage. This work presents a simulation investigation of how temperature hot spots may be detected by studying the surface temperature distribution along a switchgear bus bar chamber wall. A three-dimensional (3-D) finite element method (FEM) MV switchgear bus bar chamber is created. The heat dissipation caused by bus bar load currents and thermal localized hot spots caused by increased contact resistances is investigated. It is shown that it may be possible to detect inner hot spots on the surface of switchgear chamber walls. It is also shown that the coating and the emissivity factor of the walls have a significant influence on the detected surface temperature.",

keywords = "switchgear insulation, temperature distribution, EM and thermal analysis, finite element method, bus bar",

author = "Mijodrag Miljanovic and Martin Kearns and Stewart, {Brian G.}",

note = "{\textcopyright} 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.; 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2022 ; Conference date: 30-10-2022 Through 02-11-2022",

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month = oct,

day = "30",

language = "English",

pages = "1--4",

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TY - CONF

T1 - Temperature distribution simulation in an MV switchgear bus bar chamber

AU - Miljanovic, Mijodrag

AU - Kearns, Martin

AU - Stewart, Brian G.

N1 - © 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

PY - 2022/10/30

Y1 - 2022/10/30

N2 - Temperature is one of the main contributors for the decrease of switchgear insulation withstand capability and life expectancy. Unattended temperature rise can lead to overheating of switchgear insulation causing insulation breakdown and hence switchgear outage. This work presents a simulation investigation of how temperature hot spots may be detected by studying the surface temperature distribution along a switchgear bus bar chamber wall. A three-dimensional (3-D) finite element method (FEM) MV switchgear bus bar chamber is created. The heat dissipation caused by bus bar load currents and thermal localized hot spots caused by increased contact resistances is investigated. It is shown that it may be possible to detect inner hot spots on the surface of switchgear chamber walls. It is also shown that the coating and the emissivity factor of the walls have a significant influence on the detected surface temperature.

AB - Temperature is one of the main contributors for the decrease of switchgear insulation withstand capability and life expectancy. Unattended temperature rise can lead to overheating of switchgear insulation causing insulation breakdown and hence switchgear outage. This work presents a simulation investigation of how temperature hot spots may be detected by studying the surface temperature distribution along a switchgear bus bar chamber wall. A three-dimensional (3-D) finite element method (FEM) MV switchgear bus bar chamber is created. The heat dissipation caused by bus bar load currents and thermal localized hot spots caused by increased contact resistances is investigated. It is shown that it may be possible to detect inner hot spots on the surface of switchgear chamber walls. It is also shown that the coating and the emissivity factor of the walls have a significant influence on the detected surface temperature.

KW - switchgear insulation

KW - temperature distribution

KW - EM and thermal analysis

KW - finite element method

KW - bus bar

UR - https://ceidp.org/

M3 - Paper

SP - 1

EP - 4

T2 - 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena

Y2 - 30 October 2022 through 2 November 2022

ER -

Temperature distribution simulation in an MV switchgear bus bar chamber

Abstract

Conference

Keywords

UN SDGs

Access to Document

Other files and links

Fingerprint

EDF Substation Monitoring

Simulation of HFCT PD detection in MV bus bar chamber

Simulation of EM wave propagation in medium voltage bus bar chamber

Simulation of partial discharge electromagnetic wave propagation in a switchgear compartment

Cite this

Temperature distribution simulation in an MV switchgear bus bar chamber

Abstract

Conference

Keywords

UN SDGs

Access to Document

Other files and links

Fingerprint

Projects

EDF Substation Monitoring

Research output

Simulation of HFCT PD detection in MV bus bar chamber

Simulation of EM wave propagation in medium voltage bus bar chamber

Simulation of partial discharge electromagnetic wave propagation in a switchgear compartment

Cite this