Temperature distribution simulation in an MV switchgear bus bar chamber

Mijodrag Miljanovic, Martin Kearns, Brian G. Stewart

Research output: Contribution to conferencePaperpeer-review

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Abstract

Temperature is one of the main contributors for the decrease of switchgear insulation withstand capability and life expectancy. Unattended temperature rise can lead to overheating of switchgear insulation causing insulation breakdown and hence switchgear outage. This work presents a simulation investigation of how temperature hot spots may be detected by studying the surface temperature distribution along a switchgear bus bar chamber wall. A three-dimensional (3-D) finite element method (FEM) MV switchgear bus bar chamber is created. The heat dissipation caused by bus bar load currents and thermal localized hot spots caused by increased contact resistances is investigated. It is shown that it may be possible to detect inner hot spots on the surface of switchgear chamber walls. It is also shown that the coating and the emissivity factor of the walls have a significant influence on the detected surface temperature.
Original languageEnglish
Pages1-4
Number of pages4
Publication statusPublished - 30 Oct 2022
Event2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena -  Hilton Garden Inn Denver Union Station, Denver, United States
Duration: 30 Oct 20222 Nov 2022
https://ceidp.org/

Conference

Conference2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Abbreviated titleCEIDP 2022
Country/TerritoryUnited States
CityDenver
Period30/10/222/11/22
Internet address

Keywords

  • switchgear insulation
  • temperature distribution
  • EM and thermal analysis
  • finite element method
  • bus bar

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  • Simulation of PD RF EM wave propagation in different MV bus bar compartment configurations

    Miljanović, M., Kearns, M. & Stewart, B. G., 21 Jun 2024, 23rd International Symposium on High Voltage Engineering (ISH 2023). 46 ed. Piscataway, NJ: IEEE, Vol. 2023. p. 692-698 7 p. (IET Conference Proceedings).

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    10 Downloads (Pure)
  • Simulation of PD RF propagation in MV bus bar chambers

    Miljanovic, M., Kearns, M. & Stewart, B. G., 1 Feb 2024, 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP). IEEE, p. 1-4 4 p. (2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution book

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  • Simulation of HFCT PD detection in MV bus bar chamber

    Miljanovic, M., Kearns, M. & Stewart, B. G., 19 Jun 2022, 2022 IEEE Electrical Insulation Conference, EIC 2022. Piscataway, NJ.: IEEE, p. 162-165 4 p. (2022 IEEE Electrical Insulation Conference, EIC 2022).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution book

    Open Access
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    31 Downloads (Pure)

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