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Abstract
Temperature is one of the main contributors for the decrease of switchgear insulation withstand capability and life expectancy. Unattended temperature rise can lead to overheating of switchgear insulation causing insulation breakdown and hence switchgear outage. This work presents a simulation investigation of how temperature hot spots may be detected by studying the surface temperature distribution along a switchgear bus bar chamber wall. A three-dimensional (3-D) finite element method (FEM) MV switchgear bus bar chamber is created. The heat dissipation caused by bus bar load currents and thermal localized hot spots caused by increased contact resistances is investigated. It is shown that it may be possible to detect inner hot spots on the surface of switchgear chamber walls. It is also shown that the coating and the emissivity factor of the walls have a significant influence on the detected surface temperature.
Original language | English |
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Pages | 1-4 |
Number of pages | 4 |
Publication status | Published - 30 Oct 2022 |
Event | 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena - Hilton Garden Inn Denver Union Station, Denver, United States Duration: 30 Oct 2022 → 2 Nov 2022 https://ceidp.org/ |
Conference
Conference | 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena |
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Abbreviated title | CEIDP 2022 |
Country/Territory | United States |
City | Denver |
Period | 30/10/22 → 2/11/22 |
Internet address |
Keywords
- switchgear insulation
- temperature distribution
- EM and thermal analysis
- finite element method
- bus bar
Fingerprint
Dive into the research topics of 'Temperature distribution simulation in an MV switchgear bus bar chamber'. Together they form a unique fingerprint.Projects
- 1 Finished
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EDF Substation Monitoring
Stewart, B. (Principal Investigator)
1/10/19 → 30/09/22
Project: Research - Studentship
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Simulation of PD RF EM wave propagation in different MV bus bar compartment configurations
Miljanović, M., Kearns, M. & Stewart, B. G., 21 Jun 2024, 23rd International Symposium on High Voltage Engineering (ISH 2023). 46 ed. Piscataway, NJ: IEEE, Vol. 2023. p. 692-698 7 p. (IET Conference Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book
Open AccessFile10 Downloads (Pure) -
Simulation of PD RF propagation in MV bus bar chambers
Miljanovic, M., Kearns, M. & Stewart, B. G., 1 Feb 2024, 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP). IEEE, p. 1-4 4 p. (2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book
Open AccessFile -
Simulation of HFCT PD detection in MV bus bar chamber
Miljanovic, M., Kearns, M. & Stewart, B. G., 19 Jun 2022, 2022 IEEE Electrical Insulation Conference, EIC 2022. Piscataway, NJ.: IEEE, p. 162-165 4 p. (2022 IEEE Electrical Insulation Conference, EIC 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book
Open AccessFile31 Downloads (Pure)