Technologies for large-area electronics on deformable substrates

J. C. Sturm, P. I. Hsu, M. Huang, H. Gleskova, S. Miller, A. Darhuber, S. Wagner, Z. Suo, S. Troian

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensions are discussed.
Original languageEnglish
Title of host publicationProceedings of the electrochemical society
Subtitle of host publicationULSI Process Integration II
EditorsC. L. Claeys, F. Gonzales, J. Murota, K. Saraswat
Pages506-517
Number of pages12
Publication statusPublished - 2001

Keywords

  • technologies
  • large-area electronics
  • deformable substrates

Cite this