Technologies for large-area electronics on deformable substrates

J. C. Sturm, P. I. Hsu, M. Huang, H. Gleskova, S. Miller, A. Darhuber, S. Wagner, Z. Suo, S. Troian

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensions are discussed.
LanguageEnglish
Title of host publicationProceedings of the electrochemical society
Subtitle of host publicationULSI Process Integration II
EditorsC. L. Claeys, F. Gonzales, J. Murota, K. Saraswat
Pages506-517
Number of pages12
Publication statusPublished - 2001

Fingerprint

Metal foil
Mechanics
Electronic equipment
Substrates

Keywords

  • technologies
  • large-area electronics
  • deformable substrates

Cite this

Sturm, J. C., Hsu, P. I., Huang, M., Gleskova, H., Miller, S., Darhuber, A., ... Troian, S. (2001). Technologies for large-area electronics on deformable substrates. In C. L. Claeys, F. Gonzales, J. Murota, & K. Saraswat (Eds.), Proceedings of the electrochemical society: ULSI Process Integration II (pp. 506-517)
Sturm, J. C. ; Hsu, P. I. ; Huang, M. ; Gleskova, H. ; Miller, S. ; Darhuber, A. ; Wagner, S. ; Suo, Z. ; Troian, S. / Technologies for large-area electronics on deformable substrates. Proceedings of the electrochemical society: ULSI Process Integration II. editor / C. L. Claeys ; F. Gonzales ; J. Murota ; K. Saraswat. 2001. pp. 506-517
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title = "Technologies for large-area electronics on deformable substrates",
abstract = "In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensions are discussed.",
keywords = "technologies, large-area electronics, deformable substrates",
author = "Sturm, {J. C.} and Hsu, {P. I.} and M. Huang and H. Gleskova and S. Miller and A. Darhuber and S. Wagner and Z. Suo and S. Troian",
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Sturm, JC, Hsu, PI, Huang, M, Gleskova, H, Miller, S, Darhuber, A, Wagner, S, Suo, Z & Troian, S 2001, Technologies for large-area electronics on deformable substrates. in CL Claeys, F Gonzales, J Murota & K Saraswat (eds), Proceedings of the electrochemical society: ULSI Process Integration II. pp. 506-517.

Technologies for large-area electronics on deformable substrates. / Sturm, J. C.; Hsu, P. I.; Huang, M.; Gleskova, H.; Miller, S.; Darhuber, A.; Wagner, S.; Suo, Z.; Troian, S.

Proceedings of the electrochemical society: ULSI Process Integration II. ed. / C. L. Claeys; F. Gonzales; J. Murota; K. Saraswat. 2001. p. 506-517.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

TY - GEN

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AU - Hsu, P. I.

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AU - Gleskova, H.

AU - Miller, S.

AU - Darhuber, A.

AU - Wagner, S.

AU - Suo, Z.

AU - Troian, S.

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N2 - In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensions are discussed.

AB - In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensions are discussed.

KW - technologies

KW - large-area electronics

KW - deformable substrates

M3 - Conference contribution book

SP - 506

EP - 517

BT - Proceedings of the electrochemical society

A2 - Claeys, C. L.

A2 - Gonzales, F.

A2 - Murota, J.

A2 - Saraswat, K.

ER -

Sturm JC, Hsu PI, Huang M, Gleskova H, Miller S, Darhuber A et al. Technologies for large-area electronics on deformable substrates. In Claeys CL, Gonzales F, Murota J, Saraswat K, editors, Proceedings of the electrochemical society: ULSI Process Integration II. 2001. p. 506-517