Tapered sidewall dry etching process for GaN and its applications in device fabrication

H.W. Choi, C.W. Jeon, M.D. Dawson

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

A method of etching which allows the direct interconnection of multiple GaN-based devices is introduced. The mesa structures of devices are etched using an isotropic recipe which produces tapered sidewalls. The degree of inclination can be readily controlled through various etching parameters, which include the inductively coupled plasma power, plate power, and pressure, thus modifying the vertical and lateral etch components. This approach has been successfully adopted in the fabrication of interconnected and matrix-addressable microlight-emitting diodes, and offers superior optical and electrical performance and a high degree of uniformity compared to similar devices fabricated using conventional processes.
LanguageEnglish
Pages99-102
Number of pages3
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume23
Issue number1
DOIs
Publication statusPublished - 2005

Fingerprint

Dry etching
Etching
etching
Fabrication
fabrication
Inductively coupled plasma
Diodes
mesas
inclination
diodes
matrices

Keywords

  • light-emitting devices
  • optics
  • photonics
  • microelectronics
  • etching

Cite this

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