Submicrocristalline structure in copper after different severe plastic deformation schemes

S. V. Dobatkin; G. A. Salishchev; A. A. Kuznetsov; Tatyana Konkova

doi:10.4028/www.scientific.net/MSF.558-559.189

Submicrocristalline structure in copper after different severe plastic deformation schemes

S. V. Dobatkin^*, G. A. Salishchev, A. A. Kuznetsov, Tatyana Konkova

^*Corresponding author for this work

Design, Manufacturing And Engineering Management

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

10 Citations (Scopus)

Abstract

The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

Original language	English
Title of host publication	Recrystallization and Grain Growth III
Editors	S.-J.L Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda, Y. Ikuhara
Pages	189-194
Number of pages	6
Volume	558-559
Edition	PART 1
DOIs	https://doi.org/10.4028/www.scientific.net/MSF.558-559.189
Publication status	Published - 2007
Event	3rd International Conference on Recrystallization and Grain Growth - Jeju Island, Korea, Republic of Duration: 10 Jun 2007 → 15 Jun 2007

Publication series

Name	Materials Science Forum
Number	PART 1
Volume	558-559
ISSN (Print)	0255-5476

Conference

Conference	3rd International Conference on Recrystallization and Grain Growth
Abbreviated title	ReX and GG III
Country/Territory	Korea, Republic of
City	Jeju Island
Period	10/06/07 → 15/06/07

Keywords

accumulative roll bonding
copper
equal-channel angular pressing
multiaxial deformation
severe plastic deformation
submicrocrystalline structure

Access to Document

10.4028/www.scientific.net/MSF.558-559.189

Cite this

Dobatkin, S. V., Salishchev, G. A., Kuznetsov, A. A., & Konkova, T. (2007). Submicrocristalline structure in copper after different severe plastic deformation schemes. In S.-J. L. Kang, M. Y. Huh, N. M. Hwang, H. Homma, K. Ushioda, & Y. Ikuhara (Eds.), Recrystallization and Grain Growth III (PART 1 ed., Vol. 558-559, pp. 189-194). (Materials Science Forum; Vol. 558-559, No. PART 1). https://doi.org/10.4028/www.scientific.net/MSF.558-559.189

@inproceedings{3f54b8ef3fa943c887cd582c3247fa13,

title = "Submicrocristalline structure in copper after different severe plastic deformation schemes",

abstract = "The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest {"}steady{"} values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.",

keywords = "accumulative roll bonding, copper, equal-channel angular pressing, multiaxial deformation, severe plastic deformation, submicrocrystalline structure",

author = "Dobatkin, {S. V.} and Salishchev, {G. A.} and Kuznetsov, {A. A.} and Tatyana Konkova",

year = "2007",

doi = "10.4028/www.scientific.net/MSF.558-559.189",

language = "English",

isbn = "087849443X",

volume = "558-559",

series = "Materials Science Forum",

number = "PART 1",

pages = "189--194",

editor = "S.-J.L Kang and M.Y. Huh and Hwang, {N.M. } and H. Homma and K. Ushioda and Y. Ikuhara",

booktitle = "Recrystallization and Grain Growth III",

edition = "PART 1",

note = "3rd International Conference on Recrystallization and Grain Growth, ReX and GG III ; Conference date: 10-06-2007 Through 15-06-2007",

}

Dobatkin, SV, Salishchev, GA, Kuznetsov, AA & Konkova, T 2007, Submicrocristalline structure in copper after different severe plastic deformation schemes. in S-JL Kang, MY Huh, NM Hwang, H Homma, K Ushioda & Y Ikuhara (eds), Recrystallization and Grain Growth III. PART 1 edn, vol. 558-559, Materials Science Forum, no. PART 1, vol. 558-559, pp. 189-194, 3rd International Conference on Recrystallization and Grain Growth, Jeju Island, Korea, Republic of, 10/06/07. https://doi.org/10.4028/www.scientific.net/MSF.558-559.189

Submicrocristalline structure in copper after different severe plastic deformation schemes. / Dobatkin, S. V.; Salishchev, G. A.; Kuznetsov, A. A. et al.
Recrystallization and Grain Growth III. ed. / S.-J.L Kang; M.Y. Huh; N.M. Hwang; H. Homma; K. Ushioda; Y. Ikuhara. Vol. 558-559 PART 1. ed. 2007. p. 189-194 (Materials Science Forum; Vol. 558-559, No. PART 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

TY - GEN

T1 - Submicrocristalline structure in copper after different severe plastic deformation schemes

AU - Dobatkin, S. V.

AU - Salishchev, G. A.

AU - Kuznetsov, A. A.

AU - Konkova, Tatyana

PY - 2007

Y1 - 2007

N2 - The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

AB - The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

KW - accumulative roll bonding

KW - copper

KW - equal-channel angular pressing

KW - multiaxial deformation

KW - severe plastic deformation

KW - submicrocrystalline structure

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M3 - Conference contribution book

AN - SCOPUS:38349179749

SN - 087849443X

SN - 9780878494439

VL - 558-559

T3 - Materials Science Forum

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EP - 194

BT - Recrystallization and Grain Growth III

A2 - Kang, S.-J.L

A2 - Huh, M.Y.

A2 - Hwang, N.M.

A2 - Homma, H.

A2 - Ushioda, K.

A2 - Ikuhara, Y.

T2 - 3rd International Conference on Recrystallization and Grain Growth

Y2 - 10 June 2007 through 15 June 2007

ER -

Dobatkin SV, Salishchev GA, Kuznetsov AA, Konkova T. Submicrocristalline structure in copper after different severe plastic deformation schemes. In Kang SJL, Huh MY, Hwang NM, Homma H, Ushioda K, Ikuhara Y, editors, Recrystallization and Grain Growth III. PART 1 ed. Vol. 558-559. 2007. p. 189-194. (Materials Science Forum; PART 1). doi: 10.4028/www.scientific.net/MSF.558-559.189

Submicrocristalline structure in copper after different severe plastic deformation schemes

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Keywords

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