Submicrocristalline structure in copper after different severe plastic deformation schemes

S. V. Dobatkin, G. A. Salishchev, A. A. Kuznetsov, Tatyana Konkova

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

9 Citations (Scopus)

Abstract

The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

Original languageEnglish
Title of host publicationRecrystallization and Grain Growth III
EditorsS.-J.L Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda, Y. Ikuhara
Pages189-194
Number of pages6
Volume558-559
EditionPART 1
DOIs
Publication statusPublished - 2007
Event3rd International Conference on Recrystallization and Grain Growth - Jeju Island, Korea, Republic of
Duration: 10 Jun 200715 Jun 2007

Publication series

NameMaterials Science Forum
NumberPART 1
Volume558-559
ISSN (Print)0255-5476

Conference

Conference3rd International Conference on Recrystallization and Grain Growth
Abbreviated titleReX and GG III
CountryKorea, Republic of
CityJeju Island
Period10/06/0715/06/07

Keywords

  • accumulative roll bonding
  • copper
  • equal-channel angular pressing
  • multiaxial deformation
  • severe plastic deformation
  • submicrocrystalline structure

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