Submicrocristalline structure in copper after different severe plastic deformation schemes

S. V. Dobatkin, G. A. Salishchev, A. A. Kuznetsov, Tatyana Konkova

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

9 Citations (Scopus)

Abstract

The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

LanguageEnglish
Title of host publicationRecrystallization and Grain Growth III
EditorsS.-J.L Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda, Y. Ikuhara
Pages189-194
Number of pages6
Volume558-559
EditionPART 1
DOIs
Publication statusPublished - 2007
Event3rd International Conference on Recrystallization and Grain Growth - Jeju Island, Korea, Republic of
Duration: 10 Jun 200715 Jun 2007

Publication series

NameMaterials Science Forum
No.PART 1
Volume558-559
ISSN (Print)0255-5476

Conference

Conference3rd International Conference on Recrystallization and Grain Growth
Abbreviated titleReX and GG III
CountryKorea, Republic of
CityJeju Island
Period10/06/0715/06/07

Fingerprint

Roll bonding
Copper
Equal channel angular pressing
Plastic deformation
Oxygen
Temperature

Keywords

  • accumulative roll bonding
  • copper
  • equal-channel angular pressing
  • multiaxial deformation
  • severe plastic deformation
  • submicrocrystalline structure

Cite this

Dobatkin, S. V., Salishchev, G. A., Kuznetsov, A. A., & Konkova, T. (2007). Submicrocristalline structure in copper after different severe plastic deformation schemes. In S-J. L. Kang, M. Y. Huh, N. M. Hwang, H. Homma, K. Ushioda, & Y. Ikuhara (Eds.), Recrystallization and Grain Growth III (PART 1 ed., Vol. 558-559, pp. 189-194). (Materials Science Forum; Vol. 558-559, No. PART 1). https://doi.org/10.4028/www.scientific.net/MSF.558-559.189
Dobatkin, S. V. ; Salishchev, G. A. ; Kuznetsov, A. A. ; Konkova, Tatyana. / Submicrocristalline structure in copper after different severe plastic deformation schemes. Recrystallization and Grain Growth III. editor / S.-J.L Kang ; M.Y. Huh ; N.M. Hwang ; H. Homma ; K. Ushioda ; Y. Ikuhara. Vol. 558-559 PART 1. ed. 2007. pp. 189-194 (Materials Science Forum; PART 1).
@inproceedings{3f54b8ef3fa943c887cd582c3247fa13,
title = "Submicrocristalline structure in copper after different severe plastic deformation schemes",
abstract = "The structure and properties of oxygen-free copper (99,98{\%}) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94{\%}). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest {"}steady{"} values EL = 4 - 5{\%} were obtained in the case of ARB, and the maximum EL = 18{\%} was obtained at MD.",
keywords = "accumulative roll bonding, copper, equal-channel angular pressing, multiaxial deformation, severe plastic deformation, submicrocrystalline structure",
author = "Dobatkin, {S. V.} and Salishchev, {G. A.} and Kuznetsov, {A. A.} and Tatyana Konkova",
year = "2007",
doi = "10.4028/www.scientific.net/MSF.558-559.189",
language = "English",
isbn = "087849443X",
volume = "558-559",
series = "Materials Science Forum",
number = "PART 1",
pages = "189--194",
editor = "S.-J.L Kang and M.Y. Huh and Hwang, {N.M. } and H. Homma and K. Ushioda and Y. Ikuhara",
booktitle = "Recrystallization and Grain Growth III",
edition = "PART 1",

}

Dobatkin, SV, Salishchev, GA, Kuznetsov, AA & Konkova, T 2007, Submicrocristalline structure in copper after different severe plastic deformation schemes. in S-JL Kang, MY Huh, NM Hwang, H Homma, K Ushioda & Y Ikuhara (eds), Recrystallization and Grain Growth III. PART 1 edn, vol. 558-559, Materials Science Forum, no. PART 1, vol. 558-559, pp. 189-194, 3rd International Conference on Recrystallization and Grain Growth, Jeju Island, Korea, Republic of, 10/06/07. https://doi.org/10.4028/www.scientific.net/MSF.558-559.189

Submicrocristalline structure in copper after different severe plastic deformation schemes. / Dobatkin, S. V.; Salishchev, G. A.; Kuznetsov, A. A.; Konkova, Tatyana.

Recrystallization and Grain Growth III. ed. / S.-J.L Kang; M.Y. Huh; N.M. Hwang; H. Homma; K. Ushioda; Y. Ikuhara. Vol. 558-559 PART 1. ed. 2007. p. 189-194 (Materials Science Forum; Vol. 558-559, No. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

TY - GEN

T1 - Submicrocristalline structure in copper after different severe plastic deformation schemes

AU - Dobatkin, S. V.

AU - Salishchev, G. A.

AU - Kuznetsov, A. A.

AU - Konkova, Tatyana

PY - 2007

Y1 - 2007

N2 - The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

AB - The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicroorystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicroorystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.

KW - accumulative roll bonding

KW - copper

KW - equal-channel angular pressing

KW - multiaxial deformation

KW - severe plastic deformation

KW - submicrocrystalline structure

UR - http://www.scopus.com/inward/record.url?scp=38349179749&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.558-559.189

DO - 10.4028/www.scientific.net/MSF.558-559.189

M3 - Conference contribution book

SN - 087849443X

SN - 9780878494439

VL - 558-559

T3 - Materials Science Forum

SP - 189

EP - 194

BT - Recrystallization and Grain Growth III

A2 - Kang, S.-J.L

A2 - Huh, M.Y.

A2 - Hwang, N.M.

A2 - Homma, H.

A2 - Ushioda, K.

A2 - Ikuhara, Y.

ER -

Dobatkin SV, Salishchev GA, Kuznetsov AA, Konkova T. Submicrocristalline structure in copper after different severe plastic deformation schemes. In Kang S-JL, Huh MY, Hwang NM, Homma H, Ushioda K, Ikuhara Y, editors, Recrystallization and Grain Growth III. PART 1 ed. Vol. 558-559. 2007. p. 189-194. (Materials Science Forum; PART 1). https://doi.org/10.4028/www.scientific.net/MSF.558-559.189