Structural integrity of ultrafine grain Al-3%Mg alloy under dynamic loading conditions

S. Chidambaram, S. Giribaskar, Venkitanarayanan Parameswaran, Gouthama

Research output: Contribution to journalConference article

1 Citation (Scopus)
2 Downloads (Pure)

Abstract

Utilization of various materials for constructing dynamic components and equipments has increased ever today. The high speed deformation mechanics was studied in various scale levels, especially in micro and nano scales. Understanding the micromechanics using shock waves led to development of armor plates in military technology. One dimensional elastic stress is applied using Split Hopkinson pressure bar for the ultra-fine grain aluminum samples and microstructural evolution was discussed in detail. The material characterization of equi channel pressing and its effect on stability of material after shock wave testing is provided. The grain size of material is steadily decreased to obtain ultra-fine grain structure during equi channel pressing and by application of shock waves on those pressed samples, the grain size again increases within the material. The recovery, re-crystallization and grain growth was observed in those shock tested samples due to induced temperature during such shock testing. The existing dislocation sub structure in pressed samples devoid after inertia effects. It is proposed further to understand the interaction between precipitate particle and dislocations.

Original languageEnglish
Pages (from-to)226-233
Number of pages8
JournalProcedia Structural Integrity
Volume14
DOIs
Publication statusPublished - 11 Jun 2019
Event2nd International Conference on Structural Integrity and Exhibition, SICE 2018 - Hyderabad, India
Duration: 25 Jul 201827 Jul 2018

Keywords

  • dynamic response
  • material behaviour
  • shear band deformation
  • ultra-fine grain

Fingerprint Dive into the research topics of 'Structural integrity of ultrafine grain Al-3%Mg alloy under dynamic loading conditions'. Together they form a unique fingerprint.

Cite this