@inproceedings{5d6a0006991e4ecfa3b04ccc71f88b63,
title = "Structural features of nano-scale damascene copper lines after annealing in wide temperature range",
abstract = "Grain structure and texture evolved in damascene nano-scale copper lines after annealing in a wide temperature interval of 200°C-500°C were analyzed. Electron backscatter diffraction (EBSD) technique was used for rigorous investigation of the overburden layer, upper and bottom parts of the lines. In all cases, the microstructures were found to stabilize after achieving the same level of total grain-boundary area per unit volume. The grain growth behavior was supposed to be governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.",
keywords = "nano-scale damascene copper lines, grain structure, overburden layer, grain-boundary, electron backscatter diffraction, annealing process, thermal stability",
author = "Konkova, {Tatyana N.} and Mironov, {Serge Yu.} and Yiqing Ke and Jin Onuki",
year = "2014",
month = apr,
day = "4",
doi = "10.1149/05817.0029ecst",
language = "English",
isbn = "9781623321406",
volume = "58",
series = "ECS Transactions",
publisher = "Electrochemical Society",
number = "17",
pages = "29--36",
editor = "D. Misra",
booktitle = "Processing, Materials, and Integration of Damascene and 3D Interconnects 5",
edition = "17",
note = "224th ECS Meeting ; Conference date: 27-10-2013 Through 01-11-2013",
}