Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Dimitars Jevtics, Jack A. Smith, John McPhillimy, Benoit Guilhabert, Paul Hill, Charalambos Klitis, Antonio Hurtado, Marc Sorel, Hark Hoe Tan, Chennupati Jagadish, Martin D. Dawson, Michael J. Strain

Research output: Contribution to journalArticlepeer-review

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