Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Dimitars Jevtics, Jack A. Smith, John McPhillimy, Benoit Guilhabert, Paul Hill, Charalambos Klitis, Antonio Hurtado, Marc Sorel, Hark Hoe Tan, Chennupati Jagadish, Martin D. Dawson, Michael J. Strain

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13 Citations (Scopus)
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