Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Dimitars Jevtics; Jack A. Smith; John McPhillimy; Benoit Guilhabert; Paul Hill; Charalambos Klitis; Antonio Hurtado; Marc Sorel; Hark Hoe Tan; Chennupati Jagadish; Martin D. Dawson; Michael J. Strain

doi:10.1364/OME.432751

Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Dimitars Jevtics, Jack A. Smith, John McPhillimy, Benoit Guilhabert, Paul Hill, Charalambos Klitis, Antonio Hurtado, Marc Sorel, Hark Hoe Tan, Chennupati Jagadish, Martin D. Dawson, Michael J. Strain

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

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Abstract

The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

Original language	English
Pages (from-to)	3567-3576
Number of pages	10
Journal	Optical Materials Express
Volume	11
Issue number	10
DOIs	https://doi.org/10.1364/OME.432751
Publication status	Published - 1 Oct 2021

Keywords

transfer printing
spatially dense arrangements
semiconductor nanowire

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10.1364/OME.432751Licence: CC BY 4.0

Jevtics-etal-OME-2021-Spatially-dense-integration-of-micron-scale-devices-from-multiple-materials-on-a-single-chip-via-transfer-printingFinal published version, 4.85 MBLicence: CC BY 4.0

Cite this

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title = "Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing",

abstract = "The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.",

keywords = "transfer printing, spatially dense arrangements, semiconductor nanowire",

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doi = "10.1364/OME.432751",

language = "English",

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AU - Jevtics, Dimitars

AU - Smith, Jack A.

AU - McPhillimy, John

AU - Guilhabert, Benoit

AU - Hill, Paul

AU - Klitis, Charalambos

AU - Hurtado, Antonio

AU - Sorel, Marc

AU - Tan, Hark Hoe

AU - Jagadish, Chennupati

AU - Dawson, Martin D.

AU - Strain, Michael J.

PY - 2021/10/1

Y1 - 2021/10/1

N2 - The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.

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KW - transfer printing

KW - spatially dense arrangements

KW - semiconductor nanowire

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Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Abstract

Keywords

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Energy-efficient and high-bandwidth neuromorphic nanophotonic chips for artificial intelligence systems (ChipAI) H2020-FETOPEN

'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing

Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips

Data for: "Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing"

Cite this

Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Projects

Energy-efficient and high-bandwidth neuromorphic nanophotonic chips for artificial intelligence systems (ChipAI) H2020-FETOPEN

'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing

Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips

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Data for: "Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing"

Cite this