Smooth particle hydrodynamics study of surface defect machining for diamond turning of silicon

Amir Sarwar Mir, Xichun Luo, Amir Siddiq

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

This paper presents the feasibility study of potential application of recently developed surface defect machining (SDM) method in the fabrication of silicon and similar hard and brittle materials by using Smooth Particle Hydrodynamics (SPH) simulation approach. Inverse parametric analysis simulation study was carried out to determine the Drucker-Prager (DP) constitutive model parameters of silicon by analysing the deformed material response behaviour using various DP model parameters. Indentation test simulations were carried out to perform inverse parametric study. SPH approach was exploited to machine silicon using conventional and surface defect machining methods. To this end we delve into opportunities of exploiting SDM through optimized machining quality, reduced machining time and lowering cost. The results of conventional simulation were compared with the results of experimental diamond turning of silicon. In the SPH simulations, various types of surface defects were introduced on the work-piece prior to machining. Surface defects were equally distributed on the front face of the workpiece. The simulation study encompasses the investigation of chip formation, resultant machining forces, stresses and hydrostatic pressure with and without SDM. The study reveals the SDM process is an effective technique to manufacture hard and brittle materials as well as facilitate increased tool life. The study also divulges the importance of SPH evading the mesh distortion problem and offer natural chip formation during machining of hard and brittle materials.
LanguageEnglish
Pages1-16
Number of pages16
JournalInternational Journal of Advanced Manufacturing Technology
Early online date2 Jun 2016
DOIs
Publication statusE-pub ahead of print - 2 Jun 2016

Fingerprint

Surface defects
Diamonds
Machining
Hydrodynamics
Silicon
Brittleness
Hydrostatic pressure
Constitutive models
Indentation
Fabrication

Keywords

  • surface defect machining
  • diamond turning
  • silicon
  • SPH

Cite this

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abstract = "This paper presents the feasibility study of potential application of recently developed surface defect machining (SDM) method in the fabrication of silicon and similar hard and brittle materials by using Smooth Particle Hydrodynamics (SPH) simulation approach. Inverse parametric analysis simulation study was carried out to determine the Drucker-Prager (DP) constitutive model parameters of silicon by analysing the deformed material response behaviour using various DP model parameters. Indentation test simulations were carried out to perform inverse parametric study. SPH approach was exploited to machine silicon using conventional and surface defect machining methods. To this end we delve into opportunities of exploiting SDM through optimized machining quality, reduced machining time and lowering cost. The results of conventional simulation were compared with the results of experimental diamond turning of silicon. In the SPH simulations, various types of surface defects were introduced on the work-piece prior to machining. Surface defects were equally distributed on the front face of the workpiece. The simulation study encompasses the investigation of chip formation, resultant machining forces, stresses and hydrostatic pressure with and without SDM. The study reveals the SDM process is an effective technique to manufacture hard and brittle materials as well as facilitate increased tool life. The study also divulges the importance of SPH evading the mesh distortion problem and offer natural chip formation during machining of hard and brittle materials.",
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Smooth particle hydrodynamics study of surface defect machining for diamond turning of silicon. / Mir, Amir Sarwar; Luo, Xichun; Siddiq, Amir .

In: International Journal of Advanced Manufacturing Technology , 02.06.2016, p. 1-16.

Research output: Contribution to journalArticle

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