Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon

S. Goel, X. Luo, R.L. Reuben, W. Bin Rashid, J. N. Sun

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)

Abstract

Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.
Original languageEnglish
Title of host publicationKey Engineering Materials
Place of PublicationDurnten-Zurich, Switzerland
Pages223-228
Number of pages6
Volume496
DOIs
Publication statusPublished - 1 Dec 2011

Keywords

  • molecular dynamic simulation
  • single crystal silicon
  • single point diamond turning

Fingerprint Dive into the research topics of 'Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon'. Together they form a unique fingerprint.

  • Cite this

    Goel, S., Luo, X., Reuben, R. L., Rashid, W. B., & Sun, J. N. (2011). Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon. In Key Engineering Materials (Vol. 496, pp. 223-228). Durnten-Zurich, Switzerland. https://doi.org/10.4028/www.scientific.net/KEM.496.223