Интенсивная пластическая деформация меди при криогенной температуре

The production of metallic submicrocrystalline and nanocrystalline materials with desired physicochemical properties is an important problem of modern materials science [1]. To date, several attempts have been made to grind grain size through deformation at a cryogenic temperature [2–4], and most of this work was carried out on highly plastic copper. An urgent task is a detailed study of the microstructure after cryogenic deformation, as well as its formation mechanisms. This work was aimed at certifying the microstructure of copper subjected to low-temperature deformation. For the certification of the microstructure, a relatively new method of automatic analysis of backscattered electron diffraction patterns (EBSD) was used [5].