Abstract
The production of metallic submicrocrystalline and nanocrystalline materials with desired physicochemical properties is an important problem of modern materials science [1]. To date, several attempts have been made to grind grain size through deformation at a cryogenic temperature [2–4], and most of this work was carried out on highly plastic copper. An urgent task is a detailed study of the microstructure after cryogenic deformation, as well as its formation mechanisms. This work was aimed at certifying the microstructure of copper subjected to low-temperature deformation. For the certification of the microstructure, a relatively new method of automatic analysis of backscattered electron diffraction patterns (EBSD) was used [5].
Translated title of the contribution | Severe plastic deformation of copper at cryogenic temperature |
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Original language | Russian |
Pages | 123-126 |
Number of pages | 4 |
Publication status | Published - 21 Mar 2011 |
Event | Russian conference “Mavlutovskie chteniya” - Ufa, Russian Federation Duration: 21 Mar 2011 → 24 Mar 2011 |
Conference
Conference | Russian conference “Mavlutovskie chteniya” |
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Country | Russian Federation |
City | Ufa |
Period | 21/03/11 → 24/03/11 |
Keywords
- submicrocrystalline structure
- nanocrystalline materials
- cryogenic temperatures