Reactive evaporation of metal wire and microdeposition of metal oxide using atmospheric pressure reactive microplasma jet

Yoshiki Shimizu*, Arumugam Chandra Bose, Davide Mariotti, Takeshi Sasaki, Kazuhiro Kirihara, Tsunehisa Suzuki, Kazuo Terashima, Naoto Koshizaki

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

53 Citations (Scopus)

Abstract

We developed a safe technique without using a toxic gas source to deposit tungsten oxide on a localized specific area using an atmospheric pressure microplasma jet. In this technique, a consumable tungsten wire, inserted into a quartz nozzle for microplasma generation, was etched with an O2/Ar microplasma, and the resultant tungsten oxide was deposited on the substrate placed downstream. The process mechanism was determined by the detailed observation of the deposit and consumed wire surface after processing, and optical emission spectroscopy. This technique is expected to be utilized for the localized deposition of a variety of metal oxides by varying the kind of consumable metal wire.
Original languageEnglish
Pages (from-to)8228-8234
Number of pages7
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume45
Issue number10B
DOIs
Publication statusPublished - 24 Oct 2006

Funding

This research was partially supported by a Grant-inAid for Young Scientists (B) (Grant No. 16760103) and Scientific Research on Priority Area: Generation of microscale reactive plasma and development of their new applications from the Ministry of Education, Culture, Sports, Science, and Technology, Japan.

Keywords

  • atmospheric pressure
  • CVD
  • metal oxide
  • microdeposition
  • microplasma
  • patterning
  • plasma jet
  • reactive evaporation
  • tungsten oxide
  • wire spraying

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