Pulse plating of copper from deep eutectic solvents

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Abstract

The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.
Original languageEnglish
Pages (from-to)1247-1253
Number of pages7
JournalECS Transactions
Volume77
Issue number11
DOIs
Publication statusPublished - 1 Aug 2017
Event231st ECS Meeting: Symposium on Pulse and Pulse Reverse Electrolytic Processes - Hilton New Orleans Riverside, New Orleans, United States
Duration: 28 May 20171 Jun 2017
https://ecs.confex.com/ecs/231/webprogram/Symposium2898.html

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Keywords

  • pulse parameters
  • copper deposition
  • deep eutectic solvents
  • corosion process
  • ionic liquids

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