Pulse plating of copper from deep eutectic solvents

Todd Green, Xiaomeng Su, Sudipta Roy

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)
71 Downloads (Pure)


The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.
Original languageEnglish
Pages (from-to)1247-1253
Number of pages7
JournalECS Transactions
Issue number11
Publication statusPublished - 1 Aug 2017
Event231st ECS Meeting: Symposium on Pulse and Pulse Reverse Electrolytic Processes - Hilton New Orleans Riverside, New Orleans, United States
Duration: 28 May 20171 Jun 2017


  • pulse parameters
  • copper deposition
  • deep eutectic solvents
  • corosion process
  • ionic liquids


Dive into the research topics of 'Pulse plating of copper from deep eutectic solvents'. Together they form a unique fingerprint.

Cite this