Pulse plating of copper from deep eutectic solvents

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.

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Plating
Eutectics
Copper
Corrosion
Corrosion rate
Chlorides
Deposits
Electrodes

Keywords

  • pulse parameters
  • copper deposition
  • deep eutectic solvents
  • corosion process
  • ionic liquids

Cite this

@article{277898c832664abeb5ac3f856ac7debc,
title = "Pulse plating of copper from deep eutectic solvents",
abstract = "The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.",
keywords = "pulse parameters, copper deposition, deep eutectic solvents, corosion process, ionic liquids",
author = "Todd Green and Xiaomeng Su and Sudipta Roy",
year = "2017",
month = "8",
day = "1",
doi = "10.1149/07711.1247ecst",
language = "English",
volume = "77",
pages = "1247--1253",
journal = "ECS Transactions",
issn = "1938-5862",
number = "11",

}

Pulse plating of copper from deep eutectic solvents. / Green, Todd; Su, Xiaomeng; Roy, Sudipta.

In: ECS Transactions, Vol. 77, No. 11, 01.08.2017, p. 1247-1253.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Pulse plating of copper from deep eutectic solvents

AU - Green, Todd

AU - Su, Xiaomeng

AU - Roy, Sudipta

PY - 2017/8/1

Y1 - 2017/8/1

N2 - The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.

AB - The effect of pulse parameters on the deposition of copper from a chloride-based deep eutectic solvent (DES) was investigated. While satisfactory deposits could be obtained for some pulse conditions, at small duty cycles or long off-times the current efficiencies obtained were very low. These findings were consistent with a corrosion process occurring during the off-time, most likely the comproportionation reaction: Cu + CuIICl4 2- → 2CuICl2 - . Initial experimental results were consistent with the corrosion rate being controlled by the transport of the CuIICl4 2- species to the electrode surface. With this assumption, a simple corrosion model was developed to account for the observed loss in current efficiency as a function of the pulse conditions. While this model broadly predicts the observed results some discrepancy between the observed and measured were noted.

KW - pulse parameters

KW - copper deposition

KW - deep eutectic solvents

KW - corosion process

KW - ionic liquids

UR - http://ecst.ecsdl.org/

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DO - 10.1149/07711.1247ecst

M3 - Article

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EP - 1253

JO - ECS Transactions

T2 - ECS Transactions

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