Promising lithography techniques for next generation logic devices: a review

Research output: Contribution to journalReview article

Abstract

Continuous rapid shrinking of feature size made the authorities to seek alternative patterning methods as the conventional photolithography comes with its intrinsic resolution limit. In this regard, some promising techniques have been proposed as next generation lithography (NGL) that have the potentials to achieve both high volume production and very high resolution. This article reviews the promising next generation lithography techniques and introduces the challenges and a perspective on future directions of the NGL techniques. Extreme Ultraviolet Lithography (EUVL) is considered as the main candidate for sub-10 nm manufacturing and it could potentially meet the current requirements of the industry. Remarkable progress in EUVL has been made and the tools will be available for commercial operation soon. Maskless lithography techniques are used for patterning in R&D, mask/mold fabrication and low volume chip design. Directed Self Assembly (DSA) has already been realized in laboratory and further effort will be needed to make it as NGL solution. Nanoimprint Lithography has emerged attractively due to its simple process-steps, high-throughput, high-resolution and low-cost and become one of the commercial platforms for nanofabrication. However, a number of challenging issues are waiting ahead and further technological progresses are required to make the techniques significant and reliable to meet the current demand. Finally, a comparative study is presented among these techniques.
LanguageEnglish
Number of pages15
JournalNanomanufacturing and Metrology
Early online date23 Apr 2018
DOIs
Publication statusE-pub ahead of print - 23 Apr 2018

Fingerprint

Logic devices
Lithography
Extreme ultraviolet lithography
Nanoimprint lithography
Photolithography
Nanotechnology
Self assembly
Masks
Throughput
Fabrication
Costs
Industry

Keywords

  • nanolithography
  • throughput
  • resolution
  • defect density
  • overlay

Cite this

@article{99af4dfb6c10498da1ec8b49a969c076,
title = "Promising lithography techniques for next generation logic devices: a review",
abstract = "Continuous rapid shrinking of feature size made the authorities to seek alternative patterning methods as the conventional photolithography comes with its intrinsic resolution limit. In this regard, some promising techniques have been proposed as next generation lithography (NGL) that have the potentials to achieve both high volume production and very high resolution. This article reviews the promising next generation lithography techniques and introduces the challenges and a perspective on future directions of the NGL techniques. Extreme Ultraviolet Lithography (EUVL) is considered as the main candidate for sub-10 nm manufacturing and it could potentially meet the current requirements of the industry. Remarkable progress in EUVL has been made and the tools will be available for commercial operation soon. Maskless lithography techniques are used for patterning in R&D, mask/mold fabrication and low volume chip design. Directed Self Assembly (DSA) has already been realized in laboratory and further effort will be needed to make it as NGL solution. Nanoimprint Lithography has emerged attractively due to its simple process-steps, high-throughput, high-resolution and low-cost and become one of the commercial platforms for nanofabrication. However, a number of challenging issues are waiting ahead and further technological progresses are required to make the techniques significant and reliable to meet the current demand. Finally, a comparative study is presented among these techniques.",
keywords = "nanolithography, throughput, resolution, defect density, overlay",
author = "Hasan, {Rashed Md. Murad} and Xichun Luo",
year = "2018",
month = "4",
day = "23",
doi = "10.1007/s41871-018-0016-9",
language = "English",
journal = "Nanomanufacturing and Metrology",
issn = "2520-811X",
publisher = "Springer",

}

TY - JOUR

T1 - Promising lithography techniques for next generation logic devices

T2 - Nanomanufacturing and Metrology

AU - Hasan, Rashed Md. Murad

AU - Luo, Xichun

PY - 2018/4/23

Y1 - 2018/4/23

N2 - Continuous rapid shrinking of feature size made the authorities to seek alternative patterning methods as the conventional photolithography comes with its intrinsic resolution limit. In this regard, some promising techniques have been proposed as next generation lithography (NGL) that have the potentials to achieve both high volume production and very high resolution. This article reviews the promising next generation lithography techniques and introduces the challenges and a perspective on future directions of the NGL techniques. Extreme Ultraviolet Lithography (EUVL) is considered as the main candidate for sub-10 nm manufacturing and it could potentially meet the current requirements of the industry. Remarkable progress in EUVL has been made and the tools will be available for commercial operation soon. Maskless lithography techniques are used for patterning in R&D, mask/mold fabrication and low volume chip design. Directed Self Assembly (DSA) has already been realized in laboratory and further effort will be needed to make it as NGL solution. Nanoimprint Lithography has emerged attractively due to its simple process-steps, high-throughput, high-resolution and low-cost and become one of the commercial platforms for nanofabrication. However, a number of challenging issues are waiting ahead and further technological progresses are required to make the techniques significant and reliable to meet the current demand. Finally, a comparative study is presented among these techniques.

AB - Continuous rapid shrinking of feature size made the authorities to seek alternative patterning methods as the conventional photolithography comes with its intrinsic resolution limit. In this regard, some promising techniques have been proposed as next generation lithography (NGL) that have the potentials to achieve both high volume production and very high resolution. This article reviews the promising next generation lithography techniques and introduces the challenges and a perspective on future directions of the NGL techniques. Extreme Ultraviolet Lithography (EUVL) is considered as the main candidate for sub-10 nm manufacturing and it could potentially meet the current requirements of the industry. Remarkable progress in EUVL has been made and the tools will be available for commercial operation soon. Maskless lithography techniques are used for patterning in R&D, mask/mold fabrication and low volume chip design. Directed Self Assembly (DSA) has already been realized in laboratory and further effort will be needed to make it as NGL solution. Nanoimprint Lithography has emerged attractively due to its simple process-steps, high-throughput, high-resolution and low-cost and become one of the commercial platforms for nanofabrication. However, a number of challenging issues are waiting ahead and further technological progresses are required to make the techniques significant and reliable to meet the current demand. Finally, a comparative study is presented among these techniques.

KW - nanolithography

KW - throughput

KW - resolution

KW - defect density

KW - overlay

UR - https://link.springer.com/journal/41871

U2 - 10.1007/s41871-018-0016-9

DO - 10.1007/s41871-018-0016-9

M3 - Review article

JO - Nanomanufacturing and Metrology

JF - Nanomanufacturing and Metrology

SN - 2520-811X

ER -