Prognostic modeling for electrical treeing in solid insulation using pulse sequence analysis

N Nur Hakimah Binti Ab Aziz, Victoria Catterson, Martin Judd, S.M. Rowland, S. Bahadoorsingh

Research output: Contribution to conferencePaper

5 Citations (Scopus)
178 Downloads (Pure)

Abstract

This paper presents a prognostic framework for estimating the time-to-failure (TTF) of insulation samples under electrical treeing stress. The degradation data is taken from electrical treeing experiments on 25 epoxy resin samples. Breakdown occurs in all tests within 2.5 hours. Partial discharge (PD) data from 18 samples are used as training data for prognostic modeling and 7 for model validation. The degradation parameter used in this model is the voltage difference between consecutive PD pulses, which decreases prior to breakdown. Every training sample shows a decreasing exponential trend when plotting the root mean squared (RMS) of the voltage difference for 5 minute batches of data. An average model from the training data is developed to determine the RMS voltage difference during breakdown. This breakdown indicator is verified over three time horizons of 25, 50 and 75 minutes. Results show the best estimation of TTF for 50 minutes of data, with error within quantified bounds. This suggests the framework is a promising approach to estimating insulation TTF.
Original languageEnglish
Number of pages4
DOIs
Publication statusPublished - Oct 2014
Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - Des Moines, United States
Duration: 19 Oct 201422 Oct 2014

Conference

Conference2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena
CountryUnited States
CityDes Moines
Period19/10/1422/10/14

Keywords

  • time-to-failure (TTF)
  • insuluation
  • electrical treeing
  • insulation TTF

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  • Cite this

    Nur Hakimah Binti Ab Aziz, N., Catterson, V., Judd, M., Rowland, S. M., & Bahadoorsingh, S. (2014). Prognostic modeling for electrical treeing in solid insulation using pulse sequence analysis. Paper presented at 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, Des Moines, United States. https://doi.org/10.1109/CEIDP.2014.6995906