Peridynamic solution of wetness equation with time dependent saturated concentration in ANSYS framework

Cagan Diyaroglu, Erdogan Madenci, Selda Oterkus, Erkan Oterkus

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Abstract

The components of Integrated Circuit (IC) devices are susceptible to moisture absorption at different stages of the production environment which can lead to hygrothermal stresses during the surface mounting process. The moisture concentration in electronic packages can be determined based on the wetness approach. If the saturated concentration value is dependent on temperature or time, the analogy between the wetness equation and the standard diffusion equation is not valid and requires special treatment. In this study, an alternative formulation, peridynamics, is utilized for the solution of wetness field equation in the case of saturated concentration varying with time. The formulation is implemented in the commercial finite element software, ANSYS, by utilizing traditional finite elements and solvers to make the computations more efficient. The peridynamic wetness approach is validated by considering various problem cases for absorption and desorption with multi-material systems representative of electronic packages.
Original languageEnglish
Title of host publication2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
Place of PublicationPiscataway, N.J.
PublisherIEEE
Number of pages6
ISBN (Print)978-1-5090-6315-4
DOIs
Publication statusPublished - 3 Aug 2017
Event2017 IEEE 67th Electronic Components and Technology Conference - Orlando, FL., United States
Duration: 30 May 20172 Jun 2017
Conference number: 67th

Conference

Conference2017 IEEE 67th Electronic Components and Technology Conference
Abbreviated titleECTC 2017
CountryUnited States
CityOrlando, FL.
Period30/05/172/06/17

Keywords

  • finite element analysis
  • absorption
  • ocean temperature
  • peridynamics

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    Diyaroglu, C., Madenci, E., Oterkus, S., & Oterkus, E. (2017). Peridynamic solution of wetness equation with time dependent saturated concentration in ANSYS framework. In 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) IEEE. https://doi.org/10.1109/ECTC.2017.297