PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS)

P. H. Kydd, G. A. Jablonski, D. L. Richard, Helena Gleskova

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Abstract

This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.
LanguageEnglish
Title of host publicationOrganic High Density Interconnect Structures (HDIS)
Pages174-180
Number of pages7
Publication statusPublished - 21 Nov 1997

Fingerprint

Metallizing
Networks (circuits)

Keywords

  • photodefined dielectrics
  • microvias
  • metallization
  • circuit traces
  • Electrical engineering. Electronics Nuclear engineering
  • Electrical and Electronic Engineering

Cite this

Kydd, P. H., Jablonski, G. A., Richard, D. L., & Gleskova, H. (1997). PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS). In Organic High Density Interconnect Structures (HDIS) (pp. 174-180)
Kydd, P. H. ; Jablonski, G. A. ; Richard, D. L. ; Gleskova, Helena. / PARAMOD metallization of circuit traces and microvias in photodefined dielectrics : Organic High Density Interconnect Structures (HDIS). Organic High Density Interconnect Structures (HDIS). 1997. pp. 174-180
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abstract = "This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.",
keywords = "photodefined dielectrics, microvias, metallization, circuit traces, Electrical engineering. Electronics Nuclear engineering, Electrical and Electronic Engineering",
author = "Kydd, {P. H.} and Jablonski, {G. A.} and Richard, {D. L.} and Helena Gleskova",
note = "M1 - Conference contribution",
year = "1997",
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language = "English",
isbn = "9781580985239",
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booktitle = "Organic High Density Interconnect Structures (HDIS)",

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Kydd, PH, Jablonski, GA, Richard, DL & Gleskova, H 1997, PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS). in Organic High Density Interconnect Structures (HDIS). pp. 174-180.

PARAMOD metallization of circuit traces and microvias in photodefined dielectrics : Organic High Density Interconnect Structures (HDIS). / Kydd, P. H.; Jablonski, G. A.; Richard, D. L.; Gleskova, Helena.

Organic High Density Interconnect Structures (HDIS). 1997. p. 174-180.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

TY - GEN

T1 - PARAMOD metallization of circuit traces and microvias in photodefined dielectrics

T2 - Organic High Density Interconnect Structures (HDIS)

AU - Kydd, P. H.

AU - Jablonski, G. A.

AU - Richard, D. L.

AU - Gleskova, Helena

N1 - M1 - Conference contribution

PY - 1997/11/21

Y1 - 1997/11/21

N2 - This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.

AB - This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.

KW - photodefined dielectrics

KW - microvias

KW - metallization

KW - circuit traces

KW - Electrical engineering. Electronics Nuclear engineering

KW - Electrical and Electronic Engineering

UR - http://www.worldcat.org/oclc/45508412

M3 - Conference contribution book

SN - 9781580985239

SP - 174

EP - 180

BT - Organic High Density Interconnect Structures (HDIS)

ER -

Kydd PH, Jablonski GA, Richard DL, Gleskova H. PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS). In Organic High Density Interconnect Structures (HDIS). 1997. p. 174-180