PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS)

P. H. Kydd; G. A. Jablonski; D. L. Richard; Helena Gleskova

PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS)

P. H. Kydd, G. A. Jablonski, D. L. Richard, Helena Gleskova

Electronic And Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution book

Abstract

This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.

Original language	English
Title of host publication	Organic High Density Interconnect Structures (HDIS)
Pages	174-180
Number of pages	7
Publication status	Published - 21 Nov 1997

Keywords

photodefined dielectrics
microvias
metallization
circuit traces
Electrical engineering. Electronics Nuclear engineering
Electrical and Electronic Engineering

Cite this

@inproceedings{efc37a53a3ef4b079aaf490f7ca6bcc8,

title = "PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS)",

abstract = "This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.",

keywords = "photodefined dielectrics, microvias, metallization, circuit traces, Electrical engineering. Electronics Nuclear engineering, Electrical and Electronic Engineering",

author = "Kydd, {P. H.} and Jablonski, {G. A.} and Richard, {D. L.} and Helena Gleskova",

note = "M1 - Conference contribution",

year = "1997",

month = nov,

day = "21",

language = "English",

isbn = "9781580985239",

pages = "174--180",

booktitle = "Organic High Density Interconnect Structures (HDIS)",

}

TY - GEN

T1 - PARAMOD metallization of circuit traces and microvias in photodefined dielectrics

T2 - Organic High Density Interconnect Structures (HDIS)

AU - Kydd, P. H.

AU - Jablonski, G. A.

AU - Richard, D. L.

AU - Gleskova, Helena

N1 - M1 - Conference contribution

PY - 1997/11/21

Y1 - 1997/11/21

N2 - This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.

AB - This paper explores PARAMOD metallization of circuit traces and microvias in photodefined dielectrics.

KW - photodefined dielectrics

KW - microvias

KW - metallization

KW - circuit traces

KW - Electrical engineering. Electronics Nuclear engineering

KW - Electrical and Electronic Engineering

UR - http://www.worldcat.org/oclc/45508412

M3 - Conference contribution book

SN - 9781580985239

SP - 174

EP - 180

BT - Organic High Density Interconnect Structures (HDIS)

ER -

PARAMOD metallization of circuit traces and microvias in photodefined dielectrics: Organic High Density Interconnect Structures (HDIS)

Abstract

Keywords

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