On the room-temperature annealing of cryogenically rolled copper

T. Konkova, S. Mironov, A. Korznikov, S. L. Semiatin

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

The electron-backscatter-diffraction (EBSD) technique was applied to investigate room-temperature annealing processes in cryogenically rolled copper during long-term (~1.5 years) storage at ambient temperature. Static recrystallization appeared to be nucleated as result of both grain-boundary bulging and recovery. A bimodal recrystallized grain size distribution appeared to be a result of these two competing mechanisms. The ultra-fine grain copper produced via cryogenic deformation was deduced to be prone to abnormal grain growth after long static storage at room-temperature.
LanguageEnglish
Pages7432-7443
Number of pages12
JournalMaterials Science and Engineering: A
Volume528
Issue number24
Early online date23 Jun 2011
DOIs
Publication statusPublished - 15 Sep 2011

Fingerprint

Copper
Annealing
bulging
copper
annealing
room temperature
ambient temperature
cryogenics
grain boundaries
grain size
recovery
Grain growth
Electron diffraction
Cryogenics
Temperature
Grain boundaries
diffraction
Recovery
electrons

Keywords

  • EBSD
  • non-ferrous alloys
  • recrystallization
  • thermomechanical processing

Cite this

Konkova, T. ; Mironov, S. ; Korznikov, A. ; Semiatin, S. L. / On the room-temperature annealing of cryogenically rolled copper. In: Materials Science and Engineering: A. 2011 ; Vol. 528, No. 24. pp. 7432-7443.
@article{d85788618cb44eea97bfad445a87f285,
title = "On the room-temperature annealing of cryogenically rolled copper",
abstract = "The electron-backscatter-diffraction (EBSD) technique was applied to investigate room-temperature annealing processes in cryogenically rolled copper during long-term (~1.5 years) storage at ambient temperature. Static recrystallization appeared to be nucleated as result of both grain-boundary bulging and recovery. A bimodal recrystallized grain size distribution appeared to be a result of these two competing mechanisms. The ultra-fine grain copper produced via cryogenic deformation was deduced to be prone to abnormal grain growth after long static storage at room-temperature.",
keywords = "EBSD, non-ferrous alloys, recrystallization, thermomechanical processing",
author = "T. Konkova and S. Mironov and A. Korznikov and Semiatin, {S. L.}",
year = "2011",
month = "9",
day = "15",
doi = "10.1016/j.msea.2011.06.047",
language = "English",
volume = "528",
pages = "7432--7443",
journal = "Materials Science and Engineering: A",
issn = "0921-5093",
number = "24",

}

On the room-temperature annealing of cryogenically rolled copper. / Konkova, T.; Mironov, S.; Korznikov, A.; Semiatin, S. L.

In: Materials Science and Engineering: A, Vol. 528, No. 24, 15.09.2011, p. 7432-7443.

Research output: Contribution to journalArticle

TY - JOUR

T1 - On the room-temperature annealing of cryogenically rolled copper

AU - Konkova, T.

AU - Mironov, S.

AU - Korznikov, A.

AU - Semiatin, S. L.

PY - 2011/9/15

Y1 - 2011/9/15

N2 - The electron-backscatter-diffraction (EBSD) technique was applied to investigate room-temperature annealing processes in cryogenically rolled copper during long-term (~1.5 years) storage at ambient temperature. Static recrystallization appeared to be nucleated as result of both grain-boundary bulging and recovery. A bimodal recrystallized grain size distribution appeared to be a result of these two competing mechanisms. The ultra-fine grain copper produced via cryogenic deformation was deduced to be prone to abnormal grain growth after long static storage at room-temperature.

AB - The electron-backscatter-diffraction (EBSD) technique was applied to investigate room-temperature annealing processes in cryogenically rolled copper during long-term (~1.5 years) storage at ambient temperature. Static recrystallization appeared to be nucleated as result of both grain-boundary bulging and recovery. A bimodal recrystallized grain size distribution appeared to be a result of these two competing mechanisms. The ultra-fine grain copper produced via cryogenic deformation was deduced to be prone to abnormal grain growth after long static storage at room-temperature.

KW - EBSD

KW - non-ferrous alloys

KW - recrystallization

KW - thermomechanical processing

UR - http://www.scopus.com/inward/record.url?scp=79960624805&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2011.06.047

DO - 10.1016/j.msea.2011.06.047

M3 - Article

VL - 528

SP - 7432

EP - 7443

JO - Materials Science and Engineering: A

T2 - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

SN - 0921-5093

IS - 24

ER -