Abstract
to other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.
| Original language | English |
|---|---|
| Pages (from-to) | 3431-3441 |
| Number of pages | 11 |
| Journal | Computational Materials Science |
| Volume | 50 |
| Issue number | 12 |
| Early online date | 23 Jul 2011 |
| DOIs | |
| Publication status | Published - Dec 2011 |
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Keywords
- nanometric cutting
- nanometric cutting mechanism
- multiscale simulation
- nano-scratching
- defect structures
- microstructures
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Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation. / Pen, Hongmin; Liang, Yingchun ; Luo, Xichun; Bai, Qingshun; goel, Saurav; Ritchie, James.
In: Computational Materials Science, Vol. 50, No. 12, 12.2011, p. 3431-3441.Research output: Contribution to journal › Article
TY - JOUR
T1 - Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation
AU - Pen, Hongmin
AU - Liang, Yingchun
AU - Luo, Xichun
AU - Bai, Qingshun
AU - goel, Saurav
AU - Ritchie, James
PY - 2011/12
Y1 - 2011/12
N2 - In this paper a multiscale simulation study was carried out in order to gain in-depth understanding of machining mechanism of nanometric cutting of single crystal copper. This study was focused on the effects of crystal orientation and cutting direction on the attainable machined surface quality. The machining mechanics was analyzed through cutting forces, chip formation morphology, generation and evolution of defects and residual stresses on the machined surface. The simulation results showed that the crystal orientation of the copper material and the cutting direction significantly influenced the deformation mechanism of the workpiece materials during the machining process. Relatively lower cutting forces were experienced while selecting crystal orientation family {1 1 1}. Dislocation movements were found to concentrate in front of the cutting chip while cutting on the (1 1 1) surface along the ½110 cutting direction thus, resulting in much smaller damaged layer on the machined surface, comparedto other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.
AB - In this paper a multiscale simulation study was carried out in order to gain in-depth understanding of machining mechanism of nanometric cutting of single crystal copper. This study was focused on the effects of crystal orientation and cutting direction on the attainable machined surface quality. The machining mechanics was analyzed through cutting forces, chip formation morphology, generation and evolution of defects and residual stresses on the machined surface. The simulation results showed that the crystal orientation of the copper material and the cutting direction significantly influenced the deformation mechanism of the workpiece materials during the machining process. Relatively lower cutting forces were experienced while selecting crystal orientation family {1 1 1}. Dislocation movements were found to concentrate in front of the cutting chip while cutting on the (1 1 1) surface along the ½110 cutting direction thus, resulting in much smaller damaged layer on the machined surface, comparedto other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.
KW - nanometric cutting
KW - nanometric cutting mechanism
KW - multiscale simulation
KW - nano-scratching
KW - defect structures
KW - microstructures
U2 - 10.1016/j.commatsci.2011.07.005
DO - 10.1016/j.commatsci.2011.07.005
M3 - Article
VL - 50
SP - 3431
EP - 3441
JO - Computational Materials Science
JF - Computational Materials Science
SN - 0927-0256
IS - 12
ER -