Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation

Hongmin Pen, Yingchun Liang, Xichun Luo, Qingshun Bai, Saurav goel, James Ritchie

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

In this paper a multiscale simulation study was carried out in order to gain in-depth understanding of machining mechanism of nanometric cutting of single crystal copper. This study was focused on the effects of crystal orientation and cutting direction on the attainable machined surface quality. The machining mechanics was analyzed through cutting forces, chip formation morphology, generation and evolution of defects and residual stresses on the machined surface. The simulation results showed that the crystal orientation of the copper material and the cutting direction significantly influenced the deformation mechanism of the workpiece materials during the machining process. Relatively lower cutting forces were experienced while selecting crystal orientation family {1 1 1}. Dislocation movements were found to concentrate in front of the cutting chip while cutting on the (1 1 1) surface along the ½110 cutting direction thus, resulting in much smaller damaged layer on the machined surface, compared
to other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.
LanguageEnglish
Pages3431-3441
Number of pages11
JournalComputational Materials Science
Volume50
Issue number12
Early online date23 Jul 2011
DOIs
Publication statusPublished - Dec 2011

Fingerprint

Multiscale Simulation
Experimental Validation
Single Crystal
Copper
Crystal
Machining
Single crystals
copper
Cutting Force
Crystal orientation
single crystals
Crystal cutting
Chip
simulation
Surface Quality
machining
Residual Stress
Dislocation
Mechanics
Defects

Keywords

  • nanometric cutting
  • nanometric cutting mechanism
  • multiscale simulation
  • nano-scratching
  • defect structures
  • microstructures

Cite this

Pen, Hongmin ; Liang, Yingchun ; Luo, Xichun ; Bai, Qingshun ; goel, Saurav ; Ritchie, James. / Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation. In: Computational Materials Science. 2011 ; Vol. 50, No. 12. pp. 3431-3441.
@article{b1857fbed9ac4534b64728b5a8ce5a92,
title = "Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation",
abstract = "In this paper a multiscale simulation study was carried out in order to gain in-depth understanding of machining mechanism of nanometric cutting of single crystal copper. This study was focused on the effects of crystal orientation and cutting direction on the attainable machined surface quality. The machining mechanics was analyzed through cutting forces, chip formation morphology, generation and evolution of defects and residual stresses on the machined surface. The simulation results showed that the crystal orientation of the copper material and the cutting direction significantly influenced the deformation mechanism of the workpiece materials during the machining process. Relatively lower cutting forces were experienced while selecting crystal orientation family {1 1 1}. Dislocation movements were found to concentrate in front of the cutting chip while cutting on the (1 1 1) surface along the ½110 cutting direction thus, resulting in much smaller damaged layer on the machined surface, comparedto other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.",
keywords = "nanometric cutting, nanometric cutting mechanism, multiscale simulation, nano-scratching, defect structures, microstructures",
author = "Hongmin Pen and Yingchun Liang and Xichun Luo and Qingshun Bai and Saurav goel and James Ritchie",
year = "2011",
month = "12",
doi = "10.1016/j.commatsci.2011.07.005",
language = "English",
volume = "50",
pages = "3431--3441",
journal = "Computational Materials Science",
issn = "0927-0256",
number = "12",

}

Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation. / Pen, Hongmin; Liang, Yingchun ; Luo, Xichun; Bai, Qingshun; goel, Saurav; Ritchie, James.

In: Computational Materials Science, Vol. 50, No. 12, 12.2011, p. 3431-3441.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Multiscale simulation of nanometric cutting of single crystal copper and its experimental validation

AU - Pen, Hongmin

AU - Liang, Yingchun

AU - Luo, Xichun

AU - Bai, Qingshun

AU - goel, Saurav

AU - Ritchie, James

PY - 2011/12

Y1 - 2011/12

N2 - In this paper a multiscale simulation study was carried out in order to gain in-depth understanding of machining mechanism of nanometric cutting of single crystal copper. This study was focused on the effects of crystal orientation and cutting direction on the attainable machined surface quality. The machining mechanics was analyzed through cutting forces, chip formation morphology, generation and evolution of defects and residual stresses on the machined surface. The simulation results showed that the crystal orientation of the copper material and the cutting direction significantly influenced the deformation mechanism of the workpiece materials during the machining process. Relatively lower cutting forces were experienced while selecting crystal orientation family {1 1 1}. Dislocation movements were found to concentrate in front of the cutting chip while cutting on the (1 1 1) surface along the ½110 cutting direction thus, resulting in much smaller damaged layer on the machined surface, comparedto other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.

AB - In this paper a multiscale simulation study was carried out in order to gain in-depth understanding of machining mechanism of nanometric cutting of single crystal copper. This study was focused on the effects of crystal orientation and cutting direction on the attainable machined surface quality. The machining mechanics was analyzed through cutting forces, chip formation morphology, generation and evolution of defects and residual stresses on the machined surface. The simulation results showed that the crystal orientation of the copper material and the cutting direction significantly influenced the deformation mechanism of the workpiece materials during the machining process. Relatively lower cutting forces were experienced while selecting crystal orientation family {1 1 1}. Dislocation movements were found to concentrate in front of the cutting chip while cutting on the (1 1 1) surface along the ½110 cutting direction thus, resulting in much smaller damaged layer on the machined surface, comparedto other orientations. This crystal orientation and cutting direction therefore recommended for nanometric cutting of single crystal copper in practical applications. A nano-scratching experiment was performed to validate the above findings.

KW - nanometric cutting

KW - nanometric cutting mechanism

KW - multiscale simulation

KW - nano-scratching

KW - defect structures

KW - microstructures

U2 - 10.1016/j.commatsci.2011.07.005

DO - 10.1016/j.commatsci.2011.07.005

M3 - Article

VL - 50

SP - 3431

EP - 3441

JO - Computational Materials Science

T2 - Computational Materials Science

JF - Computational Materials Science

SN - 0927-0256

IS - 12

ER -