Multiobjective design of IGBT power modules considering power cycling and thermal cycling

Bing Ji, Xueguan Song, Edward Sciberras, Wenping Cao, Yihua Hu, Volker Pickert

Research output: Contribution to journalArticlepeer-review

64 Citations (Scopus)
188 Downloads (Pure)


Insulated gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multi-objective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity FE model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The non-dominated sorting genetic algorithm-II (NSGA-II) is used to search for the Pareto optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.
Original languageEnglish
Number of pages12
JournalIEEE Transactions on Power Electronics
Issue number5
Early online date28 Oct 2014
Publication statusPublished - May 2015


  • finite element methods
  • insulated gate bipolar transistors
  • power cycling
  • thermal cycling


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