Monolithic integration of trench vertical DMOS (VDMOS) power transistors into a BCD process

T Dyer, J McGinty, A Strachan, C Bulucea

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

14 Citations (Scopus)

Abstract

The monolithic integration of trench vertical DMOS (VDMOS) n-channel transistors into an IC BCD process is reported for the first time. The integration scheme for the trench VDMOS module is discussed and silicon results are compared with TCAD simulations. For a 50-V device, the integrated trench device is shown to offer at least a factor-of-two R/sub DS(ON)/ /spl times/ area advantage over its planar counterpart. An R/sub DS(ON)/ /spl times/ area value of 80 m/spl Omega/mm/sup 2/ is achieved for the integrated trench VDMOS using a minimum feature size of 1 /spl mu/m.
Original languageEnglish
Title of host publicationProceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages47-50
Number of pages4
ISBN (Print)0780388909
DOIs
Publication statusPublished - 1 Aug 2005

Publication series

NameInternational Symposium on Power Semiconductor Devices and Ics (ISPSD)
PublisherIEEE
ISSN (Print)1063-6854
ISSN (Electronic)1946-0201

Keywords

  • monolithic integrated circuits
  • power transistors
  • costs
  • FETs
  • CMOS process
  • capacitors
  • etching
  • clamps
  • silicon
  • power integrated circuits

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