Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

G.S. Armstrong, R.A. Pethrick, W.M. Banks, R.L. Crane

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
Original languageEnglish
Title of host publicationAdhesive joints
Subtitle of host publicationformation, characteristics and testing
EditorsK.L Mittal
Volume2
Publication statusPublished - 1 Sep 2002

    Fingerprint

Keywords

  • monitoring
  • solvent uptake
  • adhesive bonded joints
  • novel non-destructive technique
  • high frequency dielectrics

Cite this

Armstrong, G. S., Pethrick, R. A., Banks, W. M., & Crane, R. L. (2002). Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In K. L. Mittal (Ed.), Adhesive joints: formation, characteristics and testing (Vol. 2)