Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

G.S. Armstrong, R.A. Pethrick, W.M. Banks, R.L. Crane

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
Original languageEnglish
Title of host publicationAdhesive joints
Subtitle of host publicationformation, characteristics and testing
EditorsK.L Mittal
Volume2
Publication statusPublished - 1 Sep 2002

Keywords

  • monitoring
  • solvent uptake
  • adhesive bonded joints
  • novel non-destructive technique
  • high frequency dielectrics

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