Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

G.S. Armstrong, R.A. Pethrick, W.M. Banks, R.L. Crane

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
Original languageEnglish
Title of host publicationAdhesive joints
Subtitle of host publicationformation, characteristics and testing
EditorsK.L Mittal
Volume2
Publication statusPublished - 1 Sep 2002

Fingerprint

Adhesive joints
Monitoring

Keywords

  • monitoring
  • solvent uptake
  • adhesive bonded joints
  • novel non-destructive technique
  • high frequency dielectrics

Cite this

Armstrong, G. S., Pethrick, R. A., Banks, W. M., & Crane, R. L. (2002). Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In K. L. Mittal (Ed.), Adhesive joints: formation, characteristics and testing (Vol. 2)
Armstrong, G.S. ; Pethrick, R.A. ; Banks, W.M. ; Crane, R.L. / Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. Adhesive joints: formation, characteristics and testing. editor / K.L Mittal. Vol. 2 2002.
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Armstrong, GS, Pethrick, RA, Banks, WM & Crane, RL 2002, Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. in KL Mittal (ed.), Adhesive joints: formation, characteristics and testing. vol. 2.

Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. / Armstrong, G.S.; Pethrick, R.A.; Banks, W.M.; Crane, R.L.

Adhesive joints: formation, characteristics and testing. ed. / K.L Mittal. Vol. 2 2002.

Research output: Chapter in Book/Report/Conference proceedingChapter

TY - CHAP

T1 - Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

AU - Armstrong, G.S.

AU - Pethrick, R.A.

AU - Banks, W.M.

AU - Crane, R.L.

N1 - print: 9067643718

PY - 2002/9/1

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N2 - This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

AB - This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

KW - monitoring

KW - solvent uptake

KW - adhesive bonded joints

KW - novel non-destructive technique

KW - high frequency dielectrics

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SN - 9789067643719

VL - 2

BT - Adhesive joints

A2 - Mittal, K.L

ER -

Armstrong GS, Pethrick RA, Banks WM, Crane RL. Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In Mittal KL, editor, Adhesive joints: formation, characteristics and testing. Vol. 2. 2002