Abstract
This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
Original language | English |
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Title of host publication | Adhesive joints |
Subtitle of host publication | formation, characteristics and testing |
Editors | K.L Mittal |
Volume | 2 |
Publication status | Published - 1 Sept 2002 |
Keywords
- monitoring
- solvent uptake
- adhesive bonded joints
- novel non-destructive technique
- high frequency dielectrics