Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology

Mingxia Wu, Gang Yang, Yi Yang, Yi Qin, Deqiang Yin

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Abstract

For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.
Original languageEnglish
Pages1-6
Number of pages6
DOIs
Publication statusPublished - 10 Aug 2015
Event4th International Conference on New Forming Technology - Crowne Plaza Glasgow, Glasgow, United Kingdom
Duration: 6 Aug 20159 Aug 2015
http://www.icnft2015.com/ (conference web site)

Conference

Conference4th International Conference on New Forming Technology
Abbreviated titleICNFT2015
CountryUnited Kingdom
CityGlasgow
Period6/08/159/08/15
Internet address

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Keywords

  • powder metallurgy
  • micro fabrication
  • microforming fields activated sintering technology
  • high resolution transmission electron microscopy

Cite this

Wu, M., Yang, G., Yang, Y., Qin, Y., & Yin, D. (2015). Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology. 1-6. Paper presented at 4th International Conference on New Forming Technology, Glasgow, United Kingdom. https://doi.org/10.1051/matecconf/20152110002