Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology

Mingxia Wu, Gang Yang, Yi Yang, Yi Qin, Deqiang Yin

Research output: Contribution to conferencePaper

Abstract

For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.

Conference

Conference4th International Conference on New Forming Technology
Abbreviated titleICNFT2015
CountryUnited Kingdom
CityGlasgow
Period6/08/159/08/15
Internet address

Fingerprint

Surface cleaning
Sintering
Nanoparticles
Microstructure
Vacancies
Powder metallurgy
High resolution transmission electron microscopy
Densification
Nanotechnology
Gears

Keywords

  • powder metallurgy
  • micro fabrication
  • microforming fields activated sintering technology
  • high resolution transmission electron microscopy

Cite this

Wu, M., Yang, G., Yang, Y., Qin, Y., & Yin, D. (2015). Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology. 1-6. Paper presented at 4th International Conference on New Forming Technology, Glasgow, United Kingdom. https://doi.org/10.1051/matecconf/20152110002
Wu, Mingxia ; Yang, Gang ; Yang, Yi ; Qin, Yi ; Yin, Deqiang. / Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology. Paper presented at 4th International Conference on New Forming Technology, Glasgow, United Kingdom.6 p.
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abstract = "For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.",
keywords = "powder metallurgy, micro fabrication, microforming fields activated sintering technology, high resolution transmission electron microscopy",
author = "Mingxia Wu and Gang Yang and Yi Yang and Yi Qin and Deqiang Yin",
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Wu, M, Yang, G, Yang, Y, Qin, Y & Yin, D 2015, 'Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology' Paper presented at 4th International Conference on New Forming Technology, Glasgow, United Kingdom, 6/08/15 - 9/08/15, pp. 1-6. https://doi.org/10.1051/matecconf/20152110002

Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology. / Wu, Mingxia; Yang, Gang; Yang, Yi; Qin, Yi; Yin, Deqiang.

2015. 1-6 Paper presented at 4th International Conference on New Forming Technology, Glasgow, United Kingdom.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology

AU - Wu, Mingxia

AU - Yang, Gang

AU - Yang, Yi

AU - Qin, Yi

AU - Yin, Deqiang

N1 - paper 10002

PY - 2015/8/10

Y1 - 2015/8/10

N2 - For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.

AB - For the purpose of extensive utilization of powder metallurgy to micro/nano- fabrication of materials, the micro gear was prepared by a novel method, named as micro- forming fields activated sintering technology (Micro-FAST). Surface-cleaning of particles, especially during the initial stage of sintering, is a crucial issue for the densification mechanism. However, up to date, the mechanism of surface-cleaning is too complicated to be known. In this paper, the process of surface-cleaning of Micro-FAST was studied, employing the high resolution transmission electron microscopy (HRTEM) for observation of microstructure of micro-particles. According to the evolution of the microstructure, surface-cleaning is mainly ascribed to the effect of electro-thermal focusing. The process of surface-cleaning is achieved through rearrangement of grains, formation of vacancy, migration of vacancy and enhancement of electro-thermal focusing.

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KW - micro fabrication

KW - microforming fields activated sintering technology

KW - high resolution transmission electron microscopy

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DO - 10.1051/matecconf/20152110002

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Wu M, Yang G, Yang Y, Qin Y, Yin D. Microstructure evolution and surface cleaning of Cu nanoparticles during micro-fields activated sintering technology. 2015. Paper presented at 4th International Conference on New Forming Technology, Glasgow, United Kingdom. https://doi.org/10.1051/matecconf/20152110002