Microstructural response of pure copper to cryogenic rolling

T. Konkova, S. Mironov, A. Korznikov, S. L. Semiatin

Research output: Contribution to journalArticle

76 Citations (Scopus)

Abstract

A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure development and texture evolution during/after cryogenic rolling of pure copper. Microstructure evolution was found to be a complex process involving mainly geometrical effects associated with strain and discontinuous recrystallization but also including limited twinning and grain subdivision. Recrystallization was deduced to be static in nature and probably occurred during static storage of the material at room temperature after cryogenic rolling. The texture contained a pronounced {1 1 0}〈1 1 2〉 brass component; this observation was interpreted in terms of the suppression of cross-slip at cryogenic temperatures. In general, cryogenic rolling was found to be ineffective for the formation of a nanocrystalline structure in pure copper. 
Original languageEnglish
Pages (from-to)5262-5273
Number of pages12
JournalActa Materialia
Volume58
Issue number16
Early online date1 Jul 2010
DOIs
Publication statusPublished - 1 Sep 2010

Fingerprint

Cryogenics
Copper
Textures
Crystallization
Crystal microstructure
Twinning
Brass
Electron diffraction
Temperature
Microstructure

Keywords

  • copper
  • electron backscatter diffraction
  • microstructure
  • nanocrystalline materials
  • texture

Cite this

Konkova, T. ; Mironov, S. ; Korznikov, A. ; Semiatin, S. L. / Microstructural response of pure copper to cryogenic rolling. In: Acta Materialia. 2010 ; Vol. 58, No. 16. pp. 5262-5273.
@article{27bbda2eefe64598a289a5a5663dcf07,
title = "Microstructural response of pure copper to cryogenic rolling",
abstract = "A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure development and texture evolution during/after cryogenic rolling of pure copper. Microstructure evolution was found to be a complex process involving mainly geometrical effects associated with strain and discontinuous recrystallization but also including limited twinning and grain subdivision. Recrystallization was deduced to be static in nature and probably occurred during static storage of the material at room temperature after cryogenic rolling. The texture contained a pronounced {1 1 0}〈1 1 2〉 brass component; this observation was interpreted in terms of the suppression of cross-slip at cryogenic temperatures. In general, cryogenic rolling was found to be ineffective for the formation of a nanocrystalline structure in pure copper. ",
keywords = "copper, electron backscatter diffraction, microstructure, nanocrystalline materials, texture",
author = "T. Konkova and S. Mironov and A. Korznikov and Semiatin, {S. L.}",
year = "2010",
month = "9",
day = "1",
doi = "10.1016/j.actamat.2010.05.056",
language = "English",
volume = "58",
pages = "5262--5273",
journal = "Acta Materialia",
issn = "1359-6454",
number = "16",

}

Microstructural response of pure copper to cryogenic rolling. / Konkova, T.; Mironov, S.; Korznikov, A.; Semiatin, S. L.

In: Acta Materialia, Vol. 58, No. 16, 01.09.2010, p. 5262-5273.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Microstructural response of pure copper to cryogenic rolling

AU - Konkova, T.

AU - Mironov, S.

AU - Korznikov, A.

AU - Semiatin, S. L.

PY - 2010/9/1

Y1 - 2010/9/1

N2 - A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure development and texture evolution during/after cryogenic rolling of pure copper. Microstructure evolution was found to be a complex process involving mainly geometrical effects associated with strain and discontinuous recrystallization but also including limited twinning and grain subdivision. Recrystallization was deduced to be static in nature and probably occurred during static storage of the material at room temperature after cryogenic rolling. The texture contained a pronounced {1 1 0}〈1 1 2〉 brass component; this observation was interpreted in terms of the suppression of cross-slip at cryogenic temperatures. In general, cryogenic rolling was found to be ineffective for the formation of a nanocrystalline structure in pure copper. 

AB - A high-resolution electron backscatter diffraction technique was applied to quantify grain-structure development and texture evolution during/after cryogenic rolling of pure copper. Microstructure evolution was found to be a complex process involving mainly geometrical effects associated with strain and discontinuous recrystallization but also including limited twinning and grain subdivision. Recrystallization was deduced to be static in nature and probably occurred during static storage of the material at room temperature after cryogenic rolling. The texture contained a pronounced {1 1 0}〈1 1 2〉 brass component; this observation was interpreted in terms of the suppression of cross-slip at cryogenic temperatures. In general, cryogenic rolling was found to be ineffective for the formation of a nanocrystalline structure in pure copper. 

KW - copper

KW - electron backscatter diffraction

KW - microstructure

KW - nanocrystalline materials

KW - texture

UR - http://www.scopus.com/inward/record.url?scp=77955431338&partnerID=8YFLogxK

U2 - 10.1016/j.actamat.2010.05.056

DO - 10.1016/j.actamat.2010.05.056

M3 - Article

VL - 58

SP - 5262

EP - 5273

JO - Acta Materialia

JF - Acta Materialia

SN - 1359-6454

IS - 16

ER -