Microstructural characteristics of electrodeposited damascene copper lines

T.N. Konkova, S. Yu Mironov, Y. Ke, J. Ohnuki

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The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.
Original languageEnglish
Pages (from-to)104-107
Number of pages4
JournalLetters on Materials
Issue number2
Publication statusPublished - Apr 2014


  • copper
  • electrodeposition
  • EBSD
  • structure
  • texture
  • electron backscatter diffraction technique
  • overburden layer

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