Microstructural characteristics of electrodeposited damascene copper lines

T.N. Konkova; S. Yu Mironov; Y. Ke; J. Ohnuki

doi:10.22226/2410-3535-2014-2-104-107

Microstructural characteristics of electrodeposited damascene copper lines

T.N. Konkova, S. Yu Mironov, Y. Ke, J. Ohnuki

Design, Manufacturing And Engineering Management

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

49 Downloads (Pure)

Abstract

The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.

Original language	English
Pages (from-to)	104-107
Number of pages	4
Journal	Letters on Materials
Volume	4
Issue number	2
DOIs	https://doi.org/10.22226/2410-3535-2014-2-104-107
Publication status	Published - Apr 2014

Keywords

copper
electrodeposition
EBSD
structure
texture
electron backscatter diffraction technique
overburden layer

Access to Document

10.22226/2410-3535-2014-2-104-107Licence: CC BY 4.0

Konkova-LM2014-Microstructural-characteristics-of-electrodeposited-damascene-copper-linesFinal published version, 1.68 MBLicence: CC BY 4.0

Cite this

@article{5ecdcf5b4cb74624b32270211fb1bad4,

title = "Microstructural characteristics of electrodeposited damascene copper lines",

abstract = "The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.",

keywords = "copper, electrodeposition, EBSD, structure, texture, electron backscatter diffraction technique, overburden layer",

author = "T.N. Konkova and Mironov, {S. Yu} and Y. Ke and J. Ohnuki",

year = "2014",

month = apr,

doi = "10.22226/2410-3535-2014-2-104-107",

language = "English",

volume = "4",

pages = "104--107",

journal = "Letters on Materials",

issn = "2218-5046",

number = "2",

}

TY - JOUR

T1 - Microstructural characteristics of electrodeposited damascene copper lines

AU - Konkova, T.N.

AU - Mironov, S. Yu

AU - Ke, Y.

AU - Ohnuki, J.

PY - 2014/4

Y1 - 2014/4

N2 - The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.

AB - The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.

KW - copper

KW - electrodeposition

KW - EBSD

KW - structure

KW - texture

KW - electron backscatter diffraction technique

KW - overburden layer

U2 - 10.22226/2410-3535-2014-2-104-107

DO - 10.22226/2410-3535-2014-2-104-107

M3 - Article

SN - 2218-5046

VL - 4

SP - 104

EP - 107

JO - Letters on Materials

JF - Letters on Materials

IS - 2

ER -

Microstructural characteristics of electrodeposited damascene copper lines

Abstract

Keywords

Access to Document

Fingerprint

Cite this