The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.
- electron backscatter diffraction technique
- overburden layer
Konkova, T. N., Mironov, S. Y., Ke, Y., & Ohnuki, J. (2014). Microstructural characteristics of electrodeposited damascene copper lines. Letters on Materials, 4(2), 104-107. https://doi.org/10.22226/2410-3535-2014-2-104-107