Microstructural characteristics of electrodeposited damascene copper lines

T.N. Konkova, S. Yu Mironov, Y. Ke, J. Ohnuki

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.
LanguageEnglish
Pages104-107
Number of pages4
JournalLetters on Materials
Volume4
Issue number2
DOIs
Publication statusPublished - Apr 2014

Fingerprint

Copper
Microstructure
Electron diffraction
Wire
Transmission electron microscopy
Temperature

Keywords

  • copper
  • electrodeposition
  • EBSD
  • structure
  • texture
  • electron backscatter diffraction technique
  • overburden layer

Cite this

Konkova, T.N. ; Mironov, S. Yu ; Ke, Y. ; Ohnuki, J. / Microstructural characteristics of electrodeposited damascene copper lines. In: Letters on Materials. 2014 ; Vol. 4, No. 2. pp. 104-107.
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Microstructural characteristics of electrodeposited damascene copper lines. / Konkova, T.N.; Mironov, S. Yu; Ke, Y.; Ohnuki, J.

In: Letters on Materials, Vol. 4, No. 2, 04.2014, p. 104-107.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Microstructural characteristics of electrodeposited damascene copper lines

AU - Konkova, T.N.

AU - Mironov, S. Yu

AU - Ke, Y.

AU - Ohnuki, J.

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Y1 - 2014/4

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AB - The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study microstructure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nanoscale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstructure evolution in damascene copper lines.

KW - copper

KW - electrodeposition

KW - EBSD

KW - structure

KW - texture

KW - electron backscatter diffraction technique

KW - overburden layer

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EP - 107

JO - Letters on Materials

T2 - Letters on Materials

JF - Letters on Materials

SN - 2218-5046

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