Micromachining of a piezocomposite transducer using a copper vapour laser

R. Farlow, W. Galbraith, M. Knowles, G. Hayward

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.
Original languageEnglish
Pages (from-to)639-640
Number of pages1
JournalIEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
Volume48
Issue number3
DOIs
Publication statusPublished - May 2001

Keywords

  • laser beam machining
  • lead compounds
  • micromachining
  • piezoceramics
  • ultrasonic transducers

Fingerprint Dive into the research topics of 'Micromachining of a piezocomposite transducer using a copper vapour laser'. Together they form a unique fingerprint.

  • Cite this