Micromachining of a piezocomposite transducer using a copper vapour laser

R. Farlow; W. Galbraith; M. Knowles; G. Hayward

doi:10.1109/58.920684

Micromachining of a piezocomposite transducer using a copper vapour laser

R. Farlow, W. Galbraith, M. Knowles, G. Hayward

Electronic And Electrical Engineering

Research output: Contribution to journal › Article › peer-review

41 Citations (Scopus)

Abstract

A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.

Original language	English
Pages (from-to)	639-640
Number of pages	1
Journal	IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
Volume	48
Issue number	3
DOIs	https://doi.org/10.1109/58.920684
Publication status	Published - May 2001

Keywords

laser beam machining
lead compounds
micromachining
piezoceramics
ultrasonic transducers

Access to Document

10.1109/58.920684

Cite this

@article{5dbc29c114f0475394528743a931fcc2,

title = "Micromachining of a piezocomposite transducer using a copper vapour laser",

abstract = "A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.",

keywords = "laser beam machining, lead compounds, micromachining, piezoceramics, ultrasonic transducers",

author = "R. Farlow and W. Galbraith and M. Knowles and G. Hayward",

year = "2001",

month = may,

doi = "10.1109/58.920684",

language = "English",

volume = "48",

pages = "639--640",

journal = "IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control",

issn = "0885-3010",

number = "3",

}

TY - JOUR

T1 - Micromachining of a piezocomposite transducer using a copper vapour laser

AU - Farlow, R.

AU - Galbraith, W.

AU - Knowles, M.

AU - Hayward, G.

PY - 2001/5

Y1 - 2001/5

N2 - A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.

AB - A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.

KW - laser beam machining

KW - lead compounds

KW - micromachining

KW - piezoceramics

KW - ultrasonic transducers

UR - http://dx.doi.org/10.1109/58.920684

U2 - 10.1109/58.920684

DO - 10.1109/58.920684

M3 - Article

SN - 0885-3010

VL - 48

SP - 639

EP - 640

JO - IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

JF - IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control

IS - 3

ER -

Micromachining of a piezocomposite transducer using a copper vapour laser

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this