Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser

E. Gu, C.W. Jeon, H.W. Choi, G.B. Rice, M.D. Dawson, E.K. Illy, M.R.H. Knowles

Research output: Contribution to journalArticle

47 Citations (Scopus)

Abstract

Gallium nitride (GaN) and sapphire are important materials for fabricating photonic devices such as high brightness light emitting diodes (LEDs). These materials are strongly resistant to wet chemical etching and also, low etch rates restrict the use of dry etching. Thus, to develop alternative high resolution processing and machining techniques for these materials is important in fabricating novel photonic devices. In this work, a repetitively pulsed UV copper vapour laser (255 nm) has been used to machine and dice sapphire, GaN and micro LED devices. Machining parameters were optimised so as to achieve controllable machining and high resolution. For sapphire, well-defined grooves 30 μm wide and 430 μm deep were machined. For GaN, precision features such as holes on a tens of micron length scale have been fabricated. By using this technique, compact micro LED chips with a die spacing 100 and a 430 μm thick sapphire substrate have been successfully diced. Measurements show that the performances of LED devices are not influenced by the UV laser machining. Our results demonstrate that the pulsed UV copper vapour laser is a powerful tool for micromachining and dicing of photonic materials and devices.
LanguageEnglish
Pages462-466
Number of pages4
JournalThin Solid Films
Volume453
Issue number1
DOIs
Publication statusPublished - 8 Mar 2004

Fingerprint

Gallium nitride
Aluminum Oxide
gallium nitrides
Micromachining
micromachining
Sapphire
Light emitting diodes
Copper
Machining
sapphire
light emitting diodes
Vapors
vapors
copper
Photonic devices
Lasers
machining
lasers
photonics
Dry etching

Keywords

  • laser ablation
  • sapphire
  • gallium nitride
  • LED devices

Cite this

Gu, E. ; Jeon, C.W. ; Choi, H.W. ; Rice, G.B. ; Dawson, M.D. ; Illy, E.K. ; Knowles, M.R.H. / Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser. In: Thin Solid Films. 2004 ; Vol. 453, No. 1. pp. 462-466.
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Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser. / Gu, E.; Jeon, C.W.; Choi, H.W.; Rice, G.B.; Dawson, M.D.; Illy, E.K.; Knowles, M.R.H.

In: Thin Solid Films, Vol. 453, No. 1, 08.03.2004, p. 462-466.

Research output: Contribution to journalArticle

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AU - Jeon, C.W.

AU - Choi, H.W.

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AU - Dawson, M.D.

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AU - Knowles, M.R.H.

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