Material removal mechanisms affected by milling modes for defective KDP surfaces

Material Science

• Materials 100%
• Crystals 100%
• Surface 100%
• Laser 50%
• Surface Morphology 33%
• Surface Defect 33%
• Machining 16%
• Finite Element Modeling 16%
• Plastics 16%
• Surface Property 16%
• Optical Device 16%
• Diamond 16%
• Surface Roughness 16%

Engineering

• Milling (Machining) 100%
• Material Removal Mechanism 100%
• Surface 100%
• Defects 30%
• Chip Thickness 15%
• Specific Cutting Energy 15%
• Cutting Force 10%
• Surface Morphology 10%
• Surface Defect 10%
• Models 5%
• Foundations 5%
• Characteristics 5%
• Mechanisms 5%
• Diamond 5%
• Cutting 5%
• Finite Element Modeling 5%
• Great Influence 5%
• Service Life 5%
• Surface Quality 5%
• Laser Irradiation 5%
• Power Laser 5%
• Material Removal Process 5%
• End Milling 5%
• Milling Micro 5%
• Theoretical Study 5%
• Roughness 5%
• Trajectory 5%
• Size Effect 5%