Mass transfer considerations during pulse plating

A conceptual description of material transport through a liquid phase diffusion layer during pulse and reverse pulse current plating is provided. The formation of a dual diffusion layer, with an inner pulsating diffusion layer and an outer, unaffected diffusion layer is described. The quantification of these two layers using limiting current experiments and theoretical analysis is discussed. Based on these material transfer phenomena, the basis of selection of pulse parameters is shown. The step by step approach to use these mass transfer equations as a set of design rules, and their subsequent use in a graph to select pulse and reverse pulse parameters is described.