Mass and stiffness effects on thermal resistance at the solid-liquid interface of nanofluidic channels

Michael Frank, Michael Kio, Dimitris Drikakis, László Könözsy, Nikolaos Asproulis

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This paper investigates the effects of the wall mass, m w, and bonding stiffness, κ, on the thermal resistance at a solid–liquid interface. The main observation is that the mass influences the thermal resistance independently of its effects on the theoretical harmonic frequency, √κ/m w of the walls. We show that increasing the atomic mass of the solid particles significantly increases the temperature jump at the interface. Furthermore, this effect becomes continuously more important as the value of the bonding stiffness decreases. To understand this, we study the density profiles of the walls, which shed light on their oscillatory motion. Finally, we show that the thermal resistance behaves as a fifth order polynomial of log(m w κ).
LanguageEnglish
Pages141-146
Number of pages6
JournalJournal of Computational and Theoretical Nanoscience
Volume15
Issue number1
DOIs
Publication statusPublished - 1 Jan 2018

Fingerprint

Nanofluidics
Thermal Resistance
liquid-solid interfaces
thermal resistance
Heat resistance
stiffness
Stiffness
Liquid
Liquids
atomic weights
Density Profile
polynomials
Jump
Harmonic
Polynomials
harmonics
Decrease
Polynomial
Motion
profiles

Keywords

  • kapitza
  • mass
  • nanofluidics
  • resistance
  • thermal

Cite this

Frank, Michael ; Kio, Michael ; Drikakis, Dimitris ; Könözsy, László ; Asproulis, Nikolaos. / Mass and stiffness effects on thermal resistance at the solid-liquid interface of nanofluidic channels. In: Journal of Computational and Theoretical Nanoscience. 2018 ; Vol. 15, No. 1. pp. 141-146.
@article{f54d1783282e4977b8ae94fafe5cd7fc,
title = "Mass and stiffness effects on thermal resistance at the solid-liquid interface of nanofluidic channels",
abstract = "This paper investigates the effects of the wall mass, m w, and bonding stiffness, κ, on the thermal resistance at a solid–liquid interface. The main observation is that the mass influences the thermal resistance independently of its effects on the theoretical harmonic frequency, √κ/m w of the walls. We show that increasing the atomic mass of the solid particles significantly increases the temperature jump at the interface. Furthermore, this effect becomes continuously more important as the value of the bonding stiffness decreases. To understand this, we study the density profiles of the walls, which shed light on their oscillatory motion. Finally, we show that the thermal resistance behaves as a fifth order polynomial of log(m w κ).",
keywords = "kapitza, mass, nanofluidics, resistance, thermal",
author = "Michael Frank and Michael Kio and Dimitris Drikakis and L{\'a}szl{\'o} K{\"o}n{\"o}zsy and Nikolaos Asproulis",
year = "2018",
month = "1",
day = "1",
doi = "10.1166/jctn.2018.7066",
language = "English",
volume = "15",
pages = "141--146",
journal = "Journal of Computational and Theoretical Nanoscience",
issn = "1546-1955",
publisher = "American Scientific Publishers",
number = "1",

}

Mass and stiffness effects on thermal resistance at the solid-liquid interface of nanofluidic channels. / Frank, Michael; Kio, Michael; Drikakis, Dimitris; Könözsy, László; Asproulis, Nikolaos.

In: Journal of Computational and Theoretical Nanoscience, Vol. 15, No. 1, 01.01.2018, p. 141-146.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Mass and stiffness effects on thermal resistance at the solid-liquid interface of nanofluidic channels

AU - Frank, Michael

AU - Kio, Michael

AU - Drikakis, Dimitris

AU - Könözsy, László

AU - Asproulis, Nikolaos

PY - 2018/1/1

Y1 - 2018/1/1

N2 - This paper investigates the effects of the wall mass, m w, and bonding stiffness, κ, on the thermal resistance at a solid–liquid interface. The main observation is that the mass influences the thermal resistance independently of its effects on the theoretical harmonic frequency, √κ/m w of the walls. We show that increasing the atomic mass of the solid particles significantly increases the temperature jump at the interface. Furthermore, this effect becomes continuously more important as the value of the bonding stiffness decreases. To understand this, we study the density profiles of the walls, which shed light on their oscillatory motion. Finally, we show that the thermal resistance behaves as a fifth order polynomial of log(m w κ).

AB - This paper investigates the effects of the wall mass, m w, and bonding stiffness, κ, on the thermal resistance at a solid–liquid interface. The main observation is that the mass influences the thermal resistance independently of its effects on the theoretical harmonic frequency, √κ/m w of the walls. We show that increasing the atomic mass of the solid particles significantly increases the temperature jump at the interface. Furthermore, this effect becomes continuously more important as the value of the bonding stiffness decreases. To understand this, we study the density profiles of the walls, which shed light on their oscillatory motion. Finally, we show that the thermal resistance behaves as a fifth order polynomial of log(m w κ).

KW - kapitza

KW - mass

KW - nanofluidics

KW - resistance

KW - thermal

U2 - 10.1166/jctn.2018.7066

DO - 10.1166/jctn.2018.7066

M3 - Article

VL - 15

SP - 141

EP - 146

JO - Journal of Computational and Theoretical Nanoscience

T2 - Journal of Computational and Theoretical Nanoscience

JF - Journal of Computational and Theoretical Nanoscience

SN - 1546-1955

IS - 1

ER -