Lifetest IC failures due to metal extrusion and migration resulting from process-induced stress relief

Phil Schani, Horacio Mendez, Dean J. Dreier, Pat Liston, Michael Phillips, John Sweeney, Mark Franklin, Norm Herr, Brian Aubin, Paul Tuohy

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

1 Citation (Scopus)

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Engineering & Materials Science

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Physics & Astronomy