Abstract
In this paper, the load-displacement curve of mono-crystalline silicon is first obtained by serials of nano-indentation experiments. Then, the material constitutive model of mono-crystalline silicon is developed. On this basis, a finite element method (FEM) model for the cutting process of mono-crystalline silicon is built and the critical brittle-ductile transition thickness is obtained by cutting simulations. Moreover, the fly-cut experiments on the ultra-precision diamond machine are performed to analyze the effect of cutting speeds on the brittle-ductile transition thicknesses, which are also used to validate the simulation results. Finally, by using extended element method, the mechanism of initiation and propagation of crack in the cutting process of mono-crystal silicon is studied and the effects of cut-induced cracks on the brittle-ductile transition of mono-crystalline silicon are deeply understood.
| Original language | English |
|---|---|
| Pages (from-to) | 317-326 |
| Number of pages | 10 |
| Journal | International Journal of Advanced Manufacturing Technology |
| Volume | 95 |
| Issue number | 1-4 |
| Early online date | 23 Oct 2017 |
| DOIs | |
| Publication status | Published - 31 Mar 2018 |
Funding
Acknowledgements The authors would like to thank the National Natural Science Foundation of China (Grant No. 51475108 and Grant No. 51675352).
Keywords
- constitutive model
- FEM simulation
- mechanism of crack initiation and propagation
- mono-crystalline silicon
- nano-indentation