Investigation of the solvent uptake in adhesively bonded CFRP joints using non-destructive dielectric and destructive mechanical techniques

G.S. Armstrong, R.A. Pethrick, W.M. Banks, R.L. Crane

Research output: Contribution to conferencePaper

Abstract

This paper provides an investigation of the solvent uptake in adhesively bonded CFRP joints using non-destructive dielectric and destructive mechanical techniques
Original languageEnglish
Publication statusPublished - 2003
Event14th International Conference on Composite Materials - San Diego, United States
Duration: 14 Jul 200318 Jul 2003

Conference

Conference14th International Conference on Composite Materials
Abbreviated titleICCM-14
CountryUnited States
CitySan Diego
Period14/07/0318/07/03

Keywords

  • investigation
  • solvent uptake
  • adhesively bonded
  • cfrp joints
  • non-destructive dielectric
  • destructive mechanical techniques

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  • Cite this

    Armstrong, G. S., Pethrick, R. A., Banks, W. M., & Crane, R. L. (2003). Investigation of the solvent uptake in adhesively bonded CFRP joints using non-destructive dielectric and destructive mechanical techniques. Paper presented at 14th International Conference on Composite Materials, San Diego, United States.