Ever-decreasing component geometry has necessitated the development of micro-stamping, which allows for conductive epoxy deposits down to 0.005". This is important for dispensing in applications with very fine deposition requirements, such as beam lead diodes. Additionally, the total volume of the deposit is greatly reduced by micro-stamping due to a much smaller cross- section.
|Publication status||Published - 2007|
|Event||5th International Conference on Manufacturing Research - Leicester, United Kingdom|
Duration: 11 Sep 2007 → 13 Sep 2007
|Conference||5th International Conference on Manufacturing Research|
|City||Leicester, United Kingdom|
|Period||11/09/07 → 13/09/07|
- engineering research