Investigation of dynamical behaviours of a micro-stamping tool

M. Zhou, Y. Qin, Y. Ma, C.S. Harrison

Research output: Contribution to conferencePaperpeer-review

Abstract

Ever-decreasing component geometry has necessitated the development of micro-stamping, which allows for conductive epoxy deposits down to 0.005". This is important for dispensing in applications with very fine deposition requirements, such as beam lead diodes. Additionally, the total volume of the deposit is greatly reduced by micro-stamping due to a much smaller cross- section.
Original languageEnglish
Publication statusPublished - 2007
Event5th International Conference on Manufacturing Research - Leicester, United Kingdom
Duration: 11 Sept 200713 Sept 2007

Conference

Conference5th International Conference on Manufacturing Research
CityLeicester, United Kingdom
Period11/09/0713/09/07

Keywords

  • micro-stamping
  • manufacturing
  • engineering research
  • sensors

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