Investigating the thermal stability of 1-3 piezoelectric composite transducers by varying the thermal conductivity and glass transition temperature of the polymeric filler material

A.C.S. Parr, R.L. O'Leary, G. Hayward, G. Smillie, C.G. Benny, H.C. Ewing, A.R. MacKintosh

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

8 Citations (Scopus)
56 Downloads (Pure)

Abstract

The thermal behaviour of a number of 1-3 piezoelectric composite transducers is discussed. In particular, devices manufactured from a polymer filler with a relatively high glass to rubber transition temperature (T-g), and from polymer systems with increased thermal conductivity, are evaluated. The mechanical properties of the various filler materials were obtained via ultrasonic measurements, with the thermal properties extracted using dynamic mechanical thermal analysis (dmta), differential scanning calorimetry (dsc) and laserflash studies. A range of ultrasonic transducers were then constructed and their thermal stability studied using a combination of impedance analysis and laser surface displacement measurement.
Original languageEnglish
Title of host publication2002 IEEE Ultrasonics symposium proceedings
Place of PublicationNew York
PublisherIEEE
Pages1173-1176
Number of pages4
ISBN (Print)0780375823
DOIs
Publication statusPublished - Oct 2002
EventIEEE International Ultrasonic Symposium - Munich, Germany
Duration: 8 Oct 200211 Oct 2002

Publication series

NameUltrasonics Symposium
PublisherIEEE
ISSN (Print)1051-0117

Conference

ConferenceIEEE International Ultrasonic Symposium
CountryGermany
CityMunich
Period8/10/0211/10/02

Keywords

  • investigating
  • thermal stability
  • 1-3 piezoelectric
  • composite transducers
  • thermal conductivity
  • glass transition
  • temperature
  • polymeric filler material

Cite this

Parr, A. C. S., O'Leary, R. L., Hayward, G., Smillie, G., Benny, C. G., Ewing, H. C., & MacKintosh, A. R. (2002). Investigating the thermal stability of 1-3 piezoelectric composite transducers by varying the thermal conductivity and glass transition temperature of the polymeric filler material. In 2002 IEEE Ultrasonics symposium proceedings (pp. 1173-1176). (Ultrasonics Symposium). IEEE. https://doi.org/10.1109/ULTSYM.2002.1192502