Introducing a new method for efficient visualization of complex shape 3D ultrasonic phased-array C-scans

Carmelo Mineo, Rahul Summan, Jonathan Riise, Charles N. MacLeod, S. Gareth Pierce

Research output: Contribution to conferencePaper

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Abstract

Automated robotic inspection systems allow the collection of large data volumes, compared to existing inspection systems. To maximize the throughput associated with the non-destructive evaluation phase, it is crucial that the reconstructed inspection data sets are generated and examined rapidly without a loss of detail. Data analysis often becomes the bottleneck of automated inspections. Therefore, new data visualization tools, suitable to screen the NDT information obtained through robotic systems, are urgently required. This paper presents a new approach, for the generation of three-dimensional ultrasonic C-scans of large and complex parts, suitable for application to high data throughput ultrasonic phased array inspection. This approach produces 3D C-scan presented as colored tessellated surfaces and the approach works efficiently on challenging geometry, with concave and convex regions. Qualitative and quantitative results show that the approach runs up to 500 times faster than other C-scan visualization techniques.
Original languageEnglish
Number of pages4
Publication statusPublished - 7 Sep 2017
Event2017 IEEE International Ultrasonics Symposium, IUS 2017 - Washington, United States
Duration: 6 Sep 20179 Sep 2017
http://ewh.ieee.org/conf/ius/2017/

Conference

Conference2017 IEEE International Ultrasonics Symposium, IUS 2017
Abbreviated titleIEEE IUS 2017
CountryUnited States
CityWashington
Period6/09/179/09/17
Internet address

Keywords

  • C-scans
  • phased arrays
  • data visualisation
  • robotics
  • automated systems

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    Mineo, C., Summan, R., Riise, J., MacLeod, C. N., & Pierce, S. G. (2017). Introducing a new method for efficient visualization of complex shape 3D ultrasonic phased-array C-scans. Paper presented at 2017 IEEE International Ultrasonics Symposium, IUS 2017, Washington, United States.