Integrated mechanical, thermal, data and power transfer interfaces for future space robotics

Xiu-Tian Yan, Wiebke Brinkmann, Roberto Palazzetti, Craig Melville, Youhua Li, Sebastian Bartsch, Frank Kirchner

Research output: Contribution to journalArticle

Abstract

Connection of modules in extra-terrestrial environment is a topic of rising importance in modern orbital or planetary missions. The increasing number of satellites sent to space has introduced a large set of connections of various type, for transferring mechanical loads, data, electrical power and heat from one module to another. This paper collects and presents the different transfer types developed and used to date in robotic applications for orbital and extra-terrestrial planetary missions. The aims of this paper are to present a detailed analysis of the available technology, and to make a useful comparison between different solutions to common problems, to make order in a complex, growing, important sector as it is that of connection in space. All types are described in their base characteristics and evaluated for orbital and planetary environments. This analysis shows that despite the large number of connectors developed for each of the four functionalities (mechanical, thermal, data and electrical power) here considered, the trend is that developers are integrating more than one into a single equipment or device, to reduce costs and improve standardisation. The outcome of this literature review has been used at the early stage of the Standard Interface for Robotic Manipulation of Payloads in Future Space Missions (SIROM) project, an H2020 funded project aiming to develop a multifunctional, standard, scalable interface to be employed in extra-terrestrial missions.
LanguageEnglish
Number of pages16
JournalFrontiers in Robotics and AI
Volume5
DOIs
Publication statusPublished - 4 Jun 2018

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Robotics
Standardization
Satellites
Costs
Hot Temperature

Keywords

  • multifunctional interface
  • space robotics
  • modularity
  • transfer classification in space
  • robotic space interface

Cite this

@article{4630832dbcde4a3fab2c3a9102d9e421,
title = "Integrated mechanical, thermal, data and power transfer interfaces for future space robotics",
abstract = "Connection of modules in extra-terrestrial environment is a topic of rising importance in modern orbital or planetary missions. The increasing number of satellites sent to space has introduced a large set of connections of various type, for transferring mechanical loads, data, electrical power and heat from one module to another. This paper collects and presents the different transfer types developed and used to date in robotic applications for orbital and extra-terrestrial planetary missions. The aims of this paper are to present a detailed analysis of the available technology, and to make a useful comparison between different solutions to common problems, to make order in a complex, growing, important sector as it is that of connection in space. All types are described in their base characteristics and evaluated for orbital and planetary environments. This analysis shows that despite the large number of connectors developed for each of the four functionalities (mechanical, thermal, data and electrical power) here considered, the trend is that developers are integrating more than one into a single equipment or device, to reduce costs and improve standardisation. The outcome of this literature review has been used at the early stage of the Standard Interface for Robotic Manipulation of Payloads in Future Space Missions (SIROM) project, an H2020 funded project aiming to develop a multifunctional, standard, scalable interface to be employed in extra-terrestrial missions.",
keywords = "multifunctional interface, space robotics, modularity, transfer classification in space, robotic space interface",
author = "Xiu-Tian Yan and Wiebke Brinkmann and Roberto Palazzetti and Craig Melville and Youhua Li and Sebastian Bartsch and Frank Kirchner",
year = "2018",
month = "6",
day = "4",
doi = "10.3389/frobt.2018.00064",
language = "English",
volume = "5",
journal = "Frontiers in Robotics and AI",
issn = "2296-9144",

}

Integrated mechanical, thermal, data and power transfer interfaces for future space robotics. / Yan, Xiu-Tian; Brinkmann, Wiebke ; Palazzetti, Roberto; Melville, Craig; Li, Youhua; Bartsch, Sebastian; Kirchner, Frank.

In: Frontiers in Robotics and AI, Vol. 5, 04.06.2018.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Integrated mechanical, thermal, data and power transfer interfaces for future space robotics

AU - Yan, Xiu-Tian

AU - Brinkmann, Wiebke

AU - Palazzetti, Roberto

AU - Melville, Craig

AU - Li, Youhua

AU - Bartsch, Sebastian

AU - Kirchner, Frank

PY - 2018/6/4

Y1 - 2018/6/4

N2 - Connection of modules in extra-terrestrial environment is a topic of rising importance in modern orbital or planetary missions. The increasing number of satellites sent to space has introduced a large set of connections of various type, for transferring mechanical loads, data, electrical power and heat from one module to another. This paper collects and presents the different transfer types developed and used to date in robotic applications for orbital and extra-terrestrial planetary missions. The aims of this paper are to present a detailed analysis of the available technology, and to make a useful comparison between different solutions to common problems, to make order in a complex, growing, important sector as it is that of connection in space. All types are described in their base characteristics and evaluated for orbital and planetary environments. This analysis shows that despite the large number of connectors developed for each of the four functionalities (mechanical, thermal, data and electrical power) here considered, the trend is that developers are integrating more than one into a single equipment or device, to reduce costs and improve standardisation. The outcome of this literature review has been used at the early stage of the Standard Interface for Robotic Manipulation of Payloads in Future Space Missions (SIROM) project, an H2020 funded project aiming to develop a multifunctional, standard, scalable interface to be employed in extra-terrestrial missions.

AB - Connection of modules in extra-terrestrial environment is a topic of rising importance in modern orbital or planetary missions. The increasing number of satellites sent to space has introduced a large set of connections of various type, for transferring mechanical loads, data, electrical power and heat from one module to another. This paper collects and presents the different transfer types developed and used to date in robotic applications for orbital and extra-terrestrial planetary missions. The aims of this paper are to present a detailed analysis of the available technology, and to make a useful comparison between different solutions to common problems, to make order in a complex, growing, important sector as it is that of connection in space. All types are described in their base characteristics and evaluated for orbital and planetary environments. This analysis shows that despite the large number of connectors developed for each of the four functionalities (mechanical, thermal, data and electrical power) here considered, the trend is that developers are integrating more than one into a single equipment or device, to reduce costs and improve standardisation. The outcome of this literature review has been used at the early stage of the Standard Interface for Robotic Manipulation of Payloads in Future Space Missions (SIROM) project, an H2020 funded project aiming to develop a multifunctional, standard, scalable interface to be employed in extra-terrestrial missions.

KW - multifunctional interface

KW - space robotics

KW - modularity

KW - transfer classification in space

KW - robotic space interface

UR - https://www.frontiersin.org/journals/robotics-and-ai

U2 - 10.3389/frobt.2018.00064

DO - 10.3389/frobt.2018.00064

M3 - Article

VL - 5

JO - Frontiers in Robotics and AI

T2 - Frontiers in Robotics and AI

JF - Frontiers in Robotics and AI

SN - 2296-9144

ER -