TY - JOUR
T1 - Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper
AU - Wang, Quanlong
AU - Bai, Qingshun
AU - Chen, Jiaxuan
AU - Su, Hao
AU - Wang, Zhiguo
AU - Xie, Wenkun
N1 - Funding Information:
The authors appreciate the supports of the National Natural Science Foundation of China (grant no. 51475108). The authors would like to thank the valuable inputs from anonymous reviewers for improving the quality of this manuscript.
Publisher Copyright: © 2015, Wang et al.
Wang, Q., Bai, Q., Chen, J. et al. Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper. Nanoscale Res Lett 10, 396 (2015). https://doi.org/10.1186/s11671-015-1082-1
PY - 2015/12/1
Y1 - 2015/12/1
N2 - Large-scale molecular dynamics simulation is performed to study the nano-cutting process of single crystal copper realized by single-point diamond cutting tool in this paper. The centro-symmetry parameter is adopted to characterize the subsurface deformed layers and the distribution and evolution of the subsurface defect structures. Three-dimensional visualization and measurement technology are used to measure the depth of the subsurface deformed layers. The influence of cutting speed, cutting depth, cutting direction, and crystallographic orientation on the depth of subsurface deformed layers is systematically investigated. The results show that a lot of defect structures are formed in the subsurface of workpiece during nano-cutting process, for instance, stair-rod dislocations, stacking fault tetrahedron, atomic clusters, vacancy defects, point defects. In the process of nano-cutting, the depth of subsurface deformed layers increases with the cutting distance at the beginning, then decreases at stable cutting process, and basically remains unchanged when the cutting distance reaches up to 24 nm. The depth of subsurface deformed layers decreases with the increase in cutting speed between 50 and 300 m/s. The depth of subsurface deformed layer increases with cutting depth, proportionally, and basically remains unchanged when the cutting depth reaches over 6 nm.
AB - Large-scale molecular dynamics simulation is performed to study the nano-cutting process of single crystal copper realized by single-point diamond cutting tool in this paper. The centro-symmetry parameter is adopted to characterize the subsurface deformed layers and the distribution and evolution of the subsurface defect structures. Three-dimensional visualization and measurement technology are used to measure the depth of the subsurface deformed layers. The influence of cutting speed, cutting depth, cutting direction, and crystallographic orientation on the depth of subsurface deformed layers is systematically investigated. The results show that a lot of defect structures are formed in the subsurface of workpiece during nano-cutting process, for instance, stair-rod dislocations, stacking fault tetrahedron, atomic clusters, vacancy defects, point defects. In the process of nano-cutting, the depth of subsurface deformed layers increases with the cutting distance at the beginning, then decreases at stable cutting process, and basically remains unchanged when the cutting distance reaches up to 24 nm. The depth of subsurface deformed layers decreases with the increase in cutting speed between 50 and 300 m/s. The depth of subsurface deformed layer increases with cutting depth, proportionally, and basically remains unchanged when the cutting depth reaches over 6 nm.
KW - cutting parameters
KW - molecular dynamics
KW - nano-cutting
KW - subsurface deformed layers
KW - copper
KW - single crystal copper
UR - http://www.scopus.com/inward/record.url?scp=84957564041&partnerID=8YFLogxK
U2 - 10.1186/s11671-015-1082-1
DO - 10.1186/s11671-015-1082-1
M3 - Article
AN - SCOPUS:84957564041
SN - 1931-7573
VL - 10
SP - 1
EP - 8
JO - Nanoscale Research Letters
JF - Nanoscale Research Letters
IS - 1
M1 - 396
ER -