Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Selda Oterkus, Erdogan Madenci, Erkan Oterkus, Yuchul Hwang, Jangyong Bae, Sungwon Han

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

25 Citations (Scopus)
278 Downloads (Pure)

Abstract

This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

Original languageEnglish
Title of host publication2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
PublisherIEEE
Pages973-982
Number of pages10
ISBN (Print)9781479924073
DOIs
Publication statusPublished - 30 May 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United Kingdom
Duration: 27 May 201430 May 2014

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited Kingdom
CityOrlando
Period27/05/1430/05/14

Keywords

  • peridynamics
  • failure prediction
  • damage analysis

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  • Cite this

    Oterkus, S., Madenci, E., Oterkus, E., Hwang, Y., Bae, J., & Han, S. (2014). Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (pp. 973-982). IEEE. https://doi.org/10.1109/ECTC.2014.6897407