Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Selda Oterkus, Erdogan Madenci, Erkan Oterkus, Yuchul Hwang, Jangyong Bae, Sungwon Han

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

20 Citations (Scopus)

Abstract

This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

LanguageEnglish
Title of host publication2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
PublisherIEEE
Pages973-982
Number of pages10
ISBN (Print)9781479924073
DOIs
Publication statusPublished - 30 May 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United Kingdom
Duration: 27 May 201430 May 2014

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited Kingdom
CityOrlando
Period27/05/1430/05/14

Fingerprint

Vapors
Dissimilar materials
Integrodifferential equations
Vapor pressure
Moisture
Specifications
Hot Temperature

Keywords

  • peridynamics
  • failure prediction
  • damage analysis

Cite this

Oterkus, S., Madenci, E., Oterkus, E., Hwang, Y., Bae, J., & Han, S. (2014). Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (pp. 973-982). IEEE. https://doi.org/10.1109/ECTC.2014.6897407
Oterkus, Selda ; Madenci, Erdogan ; Oterkus, Erkan ; Hwang, Yuchul ; Bae, Jangyong ; Han, Sungwon. / Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014. pp. 973-982
@inproceedings{1c4ef10b71e8431b8dbe553b448726c1,
title = "Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics",
abstract = "This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.",
keywords = "peridynamics, failure prediction, damage analysis",
author = "Selda Oterkus and Erdogan Madenci and Erkan Oterkus and Yuchul Hwang and Jangyong Bae and Sungwon Han",
note = "(c) 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.",
year = "2014",
month = "5",
day = "30",
doi = "10.1109/ECTC.2014.6897407",
language = "English",
isbn = "9781479924073",
pages = "973--982",
booktitle = "2014 IEEE 64th Electronic Components and Technology Conference (ECTC)",
publisher = "IEEE",

}

Oterkus, S, Madenci, E, Oterkus, E, Hwang, Y, Bae, J & Han, S 2014, Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, pp. 973-982, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United Kingdom, 27/05/14. https://doi.org/10.1109/ECTC.2014.6897407

Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. / Oterkus, Selda; Madenci, Erdogan; Oterkus, Erkan; Hwang, Yuchul; Bae, Jangyong; Han, Sungwon.

2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014. p. 973-982.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

TY - GEN

T1 - Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

AU - Oterkus, Selda

AU - Madenci, Erdogan

AU - Oterkus, Erkan

AU - Hwang, Yuchul

AU - Bae, Jangyong

AU - Han, Sungwon

N1 - (c) 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

PY - 2014/5/30

Y1 - 2014/5/30

N2 - This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

AB - This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

KW - peridynamics

KW - failure prediction

KW - damage analysis

UR - http://www.scopus.com/inward/record.url?scp=84907891722&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2014.6897407

DO - 10.1109/ECTC.2014.6897407

M3 - Conference contribution book

SN - 9781479924073

SP - 973

EP - 982

BT - 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

PB - IEEE

ER -

Oterkus S, Madenci E, Oterkus E, Hwang Y, Bae J, Han S. Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE. 2014. p. 973-982 https://doi.org/10.1109/ECTC.2014.6897407