Hybrid integration of chipscale photonic devices using accurate transfer printing methods

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Transfer printing is becoming widely adopted as a back-end process for the hybrid integration of photonic and electronic devices. Integration of membrane components, with micrometer-scale footprints and sub-micron waveguide dimensions, imposes strict performance requirements on the process. In this review, we present an overview of transfer printing for integrated photonics applications, covering materials and fabrication process considerations, methods for efficient optical coupling, and high-accuracy inter-layer alignment. We present state-of-the-art integration demonstrations covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Finally, we look toward future developments in the technology that will be required for dense multi-materials integration at wafer scales.
Original languageEnglish
Article number041317
Number of pages21
JournalApplied Physics Reviews
Issue number4
Early online date8 Dec 2022
Publication statusPublished - 8 Dec 2022


  • transfer printing
  • integration
  • chipscale photonic devices
  • electronic devices
  • integrated photonics applications
  • photonic integrated circuit (PIC)


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