High accuracy transfer printing of single-mode membrane silicon photonic devices

John McPhillimy; Benoit Guilhabert; Charalambos Klitis; Martin D. Dawson; Marc Sorel; Michael J. Strain

doi:10.1364/OE.26.016679

High accuracy transfer printing of single-mode membrane silicon photonic devices

John McPhillimy, Benoit Guilhabert, Charalambos Klitis, Martin D. Dawson, Marc Sorel, Michael J. Strain

Research output: Contribution to journal › Article › peer-review

28 Citations (Scopus)

31 Downloads (Pure)

Abstract

A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices from suspended membrane components. Ultra thin membranes with thickness of 150nm are directly printed without the use of mechanical support and adhesion layers. By using a correlation alignment scheme vertical integration of single-mode silicon waveguides is achieved with an average placement accuracy of 100±70nm. Silicon (Si) µ-ring resonators are also fabricated and show controllable optical coupling by varying the lateral absolute position to an
underlying Si bus waveguide.

Original language	English
Pages (from-to)	16679-16688
Number of pages	10
Journal	Optics Express
Volume	26
Issue number	13
Early online date	14 Jun 2018
DOIs	https://doi.org/10.1364/OE.26.016679
Publication status	Published - 25 Jun 2018

Keywords

transfer printing (TP) method
micro-assembly
integrated photonic devices
ultra thin membranes

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10.1364/OE.26.016679Licence: CC BY 4.0

McPhillimy-etal-OE-2018-High-accuracy-transfer-printing-of-single-mode-membrane-silicon-photonic-devicesFinal published version, 3.53 MBLicence: CC BY 4.0

Cite this

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AU - McPhillimy, John

AU - Guilhabert, Benoit

AU - Klitis, Charalambos

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AU - Sorel, Marc

AU - Strain, Michael J.

PY - 2018/6/25

Y1 - 2018/6/25

N2 - A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices from suspended membrane components. Ultra thin membranes with thickness of 150nm are directly printed without the use of mechanical support and adhesion layers. By using a correlation alignment scheme vertical integration of single-mode silicon waveguides is achieved with an average placement accuracy of 100±70nm. Silicon (Si) µ-ring resonators are also fabricated and show controllable optical coupling by varying the lateral absolute position to anunderlying Si bus waveguide.

AB - A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices from suspended membrane components. Ultra thin membranes with thickness of 150nm are directly printed without the use of mechanical support and adhesion layers. By using a correlation alignment scheme vertical integration of single-mode silicon waveguides is achieved with an average placement accuracy of 100±70nm. Silicon (Si) µ-ring resonators are also fabricated and show controllable optical coupling by varying the lateral absolute position to anunderlying Si bus waveguide.

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KW - micro-assembly

KW - integrated photonic devices

KW - ultra thin membranes

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JO - Optics Express

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ER -

High accuracy transfer printing of single-mode membrane silicon photonic devices

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Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips

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High accuracy transfer printing of single-mode membrane silicon photonic devices

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Parallel Heterogeneous Integration of III-V Devices on Silicon Photonic Chips

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Data for: "High accuracy transfer printing of single-mode membrane silicon photonic devices"

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